JPS6035546U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS6035546U
JPS6035546U JP1983127165U JP12716583U JPS6035546U JP S6035546 U JPS6035546 U JP S6035546U JP 1983127165 U JP1983127165 U JP 1983127165U JP 12716583 U JP12716583 U JP 12716583U JP S6035546 U JPS6035546 U JP S6035546U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
tip
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983127165U
Other languages
English (en)
Inventor
幸仁 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983127165U priority Critical patent/JPS6035546U/ja
Publication of JPS6035546U publication Critical patent/JPS6035546U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、従来のＴ　Ｏ−９２タイプの樹脂封止半導体
装置の構造を示す透視図、第２図は、本考案の一実施例
の構造を示す透視図である。 １・・・樹脂モールド、２・・・ベースリボンの先端部
、３・・・ベースリボンのリード部、４・・・半導体チ
ップ、５・・・金属細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. ベースリボン先端部は封止樹脂内部で折り曲げられ、こ
    の折り曲げられた部分の先端部に半導体素子が取り付け
    られていることを特徴とする樹脂封止半導体装置。
JP1983127165U 1983-08-17 1983-08-17 樹脂封止半導体装置 Pending JPS6035546U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983127165U JPS6035546U (ja) 1983-08-17 1983-08-17 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983127165U JPS6035546U (ja) 1983-08-17 1983-08-17 樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
JPS6035546U true JPS6035546U (ja) 1985-03-11

Family

ID=30288914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983127165U Pending JPS6035546U (ja) 1983-08-17 1983-08-17 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6035546U (ja)

Similar Documents

Publication Publication Date Title
JPS6035546U (ja) 樹脂封止半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS5856446U (ja) 樹脂封止半導体装置
JPS6068654U (ja) 半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS6142852U (ja) 樹脂封止半導体装置
JPS6073249U (ja) 樹脂封止半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS6037253U (ja) 半導体装置
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS5869952U (ja) 樹脂封止半導体装置
JPS5887355U (ja) 半導体装置
JPS5987144U (ja) 樹脂封止型半導体装置
JPS60190052U (ja) 半導体装置
JPS59180447U (ja) 樹脂封止型半導体装置
JPS5945935U (ja) 樹脂封止半導体装置
JPS5914348U (ja) 樹脂封止型半導体装置
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS6016553U (ja) 樹脂封止型半導体装置
JPS59176151U (ja) 樹脂封止型半導体装置
JPS5895641U (ja) 樹脂封止半導体装置
JPS5863758U (ja) 樹脂封止型半導体装置
JPS5937749U (ja) 半導体装置用リ−ドフレ−ム
JPS59117162U (ja) 樹脂封止型半導体装置
JPS59191744U (ja) 半導体装置