JPS6035546U - 樹脂封止半導体装置 - Google Patents
樹脂封止半導体装置Info
- Publication number
- JPS6035546U JPS6035546U JP12716583U JP12716583U JPS6035546U JP S6035546 U JPS6035546 U JP S6035546U JP 12716583 U JP12716583 U JP 12716583U JP 12716583 U JP12716583 U JP 12716583U JP S6035546 U JPS6035546 U JP S6035546U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- tip
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は、従来のＴ Ｏ−９２タイプの樹脂封止半導体
装置の構造を示す透視図、第２図は、本考案の一実施例
の構造を示す透視図である。 １・・・樹脂モールド、２・・・ベースリボンの先端部
、３・・・ベースリボンのリード部、４・・・半導体チ
ップ、５・・・金属細線。
装置の構造を示す透視図、第２図は、本考案の一実施例
の構造を示す透視図である。 １・・・樹脂モールド、２・・・ベースリボンの先端部
、３・・・ベースリボンのリード部、４・・・半導体チ
ップ、５・・・金属細線。
Claims (1)
- ベースリボン先端部は封止樹脂内部で折り曲げられ、こ
の折り曲げられた部分の先端部に半導体素子が取り付け
られていることを特徴とする樹脂封止半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12716583U JPS6035546U (ja) | 1983-08-17 | 1983-08-17 | 樹脂封止半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12716583U JPS6035546U (ja) | 1983-08-17 | 1983-08-17 | 樹脂封止半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6035546U true JPS6035546U (ja) | 1985-03-11 |
Family
ID=30288914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12716583U Pending JPS6035546U (ja) | 1983-08-17 | 1983-08-17 | 樹脂封止半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035546U (ja) |
-
1983
- 1983-08-17 JP JP12716583U patent/JPS6035546U/ja active Pending
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