JPS5956757U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS5956757U
JPS5956757U JP1982152851U JP15285182U JPS5956757U JP S5956757 U JPS5956757 U JP S5956757U JP 1982152851 U JP1982152851 U JP 1982152851U JP 15285182 U JP15285182 U JP 15285182U JP S5956757 U JPS5956757 U JP S5956757U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
sealed
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982152851U
Other languages
English (en)
Inventor
浩二 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982152851U priority Critical patent/JPS5956757U/ja
Publication of JPS5956757U publication Critical patent/JPS5956757U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図および第２図は夫々本考案の半導体装置の実施例
を示す平面図である。 １・・・・・・樹脂部、２・・・・・・外部リード。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止部から外側に向けて延び不外部リードにおいて
    、前記樹脂封止部に近いリード部の幅が、それより遠い
    リード部の幅より太くなっていることを特徴とする樹脂
    封止型半導体装普。
JP1982152851U 1982-10-08 1982-10-08 樹脂封止型半導体装置 Pending JPS5956757U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982152851U JPS5956757U (ja) 1982-10-08 1982-10-08 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982152851U JPS5956757U (ja) 1982-10-08 1982-10-08 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS5956757U true JPS5956757U (ja) 1984-04-13

Family

ID=30338335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982152851U Pending JPS5956757U (ja) 1982-10-08 1982-10-08 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5956757U (ja)

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