JPS59151446U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59151446U
JPS59151446U JP1983045936U JP4593683U JPS59151446U JP S59151446 U JPS59151446 U JP S59151446U JP 1983045936 U JP1983045936 U JP 1983045936U JP 4593683 U JP4593683 U JP 4593683U JP S59151446 U JPS59151446 U JP S59151446U
Authority
JP
Japan
Prior art keywords
package
semiconductor equipment
semiconductor chip
semiconductor
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983045936U
Other languages
English (en)
Inventor
安瀬　博章
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1983045936U priority Critical patent/JPS59151446U/ja
Publication of JPS59151446U publication Critical patent/JPS59151446U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ないし第３図は夫々互いに異なる本考案の半導体
装置の実施例を示す断面図である。 １・・・上パッケージ、２・・・下パッケージ、３・・
・半導体チップ、４・・・外部リード、７．８・・・シ
ールド板、９．１１・・・モールド樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. パッケージと、このパッケージの内部に設けられた半導
    体チップと、この半導体チップと接続した外部リードと
    、前記パッケージに設けられた非晶質磁性合金薄板から
    なるシールド板とからなる半導体装置。
JP1983045936U 1983-03-30 1983-03-30 半導体装置 Pending JPS59151446U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983045936U JPS59151446U (ja) 1983-03-30 1983-03-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983045936U JPS59151446U (ja) 1983-03-30 1983-03-30 半導体装置

Publications (1)

Publication Number Publication Date
JPS59151446U true JPS59151446U (ja) 1984-10-11

Family

ID=30176479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983045936U Pending JPS59151446U (ja) 1983-03-30 1983-03-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS59151446U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437043A (en) * 1987-07-31 1989-02-07 Nec Corp Resin-sealed semiconductor device
JPH02297954A (ja) * 1989-02-14 1990-12-10 Mitsubishi Electric Corp 集積回路のシールド構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437043A (en) * 1987-07-31 1989-02-07 Nec Corp Resin-sealed semiconductor device
JPH02297954A (ja) * 1989-02-14 1990-12-10 Mitsubishi Electric Corp 集積回路のシールド構造

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