JPS6437043A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS6437043A JPS6437043A JP19283287A JP19283287A JPS6437043A JP S6437043 A JPS6437043 A JP S6437043A JP 19283287 A JP19283287 A JP 19283287A JP 19283287 A JP19283287 A JP 19283287A JP S6437043 A JPS6437043 A JP S6437043A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin body
- metal layer
- resin
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve a device in resistance to humidity by a method wherein a metal layer, covering the surface of a first resin body except a spot for a lead to come out, and a second resin body, covering the surface including the metal layer, are provided. CONSTITUTION:A device of this design is constructed of a semiconductor chip 2 installed on an island 1 on a leadframe, a bonding line 4 that connects an electrode of the semiconductor chip 2 and the inner end of a lead 3 of the lead frame, a first resin body 5 providing a seal on the island 1 and the inner end of the lead 3, a metal layer 7 covering the surface except a spot where the lead 3 comes out of the surface of the first resin body 5, and a second resin body 8 providing a seal on the surface including the metal layer 7. This design prevents water from penetrating in through the resin surface, which enhances the reliability of a semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19283287A JPS6437043A (en) | 1987-07-31 | 1987-07-31 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19283287A JPS6437043A (en) | 1987-07-31 | 1987-07-31 | Resin-sealed semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6437043A true JPS6437043A (en) | 1989-02-07 |
JPH0567069B2 JPH0567069B2 (en) | 1993-09-24 |
Family
ID=16297720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19283287A Granted JPS6437043A (en) | 1987-07-31 | 1987-07-31 | Resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6437043A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600181A (en) * | 1995-05-24 | 1997-02-04 | Lockheed Martin Corporation | Hermetically sealed high density multi-chip package |
US6535392B2 (en) | 2000-08-11 | 2003-03-18 | Denso Corporation | Voltage control apparatus for vehicle AC generator |
US9070793B2 (en) | 2010-08-02 | 2015-06-30 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having electromagnetic interference shielding and related methods |
WO2016067930A1 (en) * | 2014-10-29 | 2016-05-06 | 日立オートモティブシステムズ株式会社 | Electronic device and method for manufacturing electronic device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5165664U (en) * | 1974-11-15 | 1976-05-24 | ||
JPS5972748A (en) * | 1982-10-20 | 1984-04-24 | Nec Kyushu Ltd | Semiconductor device |
JPS59151446U (en) * | 1983-03-30 | 1984-10-11 | 株式会社東芝 | semiconductor equipment |
-
1987
- 1987-07-31 JP JP19283287A patent/JPS6437043A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5165664U (en) * | 1974-11-15 | 1976-05-24 | ||
JPS5972748A (en) * | 1982-10-20 | 1984-04-24 | Nec Kyushu Ltd | Semiconductor device |
JPS59151446U (en) * | 1983-03-30 | 1984-10-11 | 株式会社東芝 | semiconductor equipment |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600181A (en) * | 1995-05-24 | 1997-02-04 | Lockheed Martin Corporation | Hermetically sealed high density multi-chip package |
US6535392B2 (en) | 2000-08-11 | 2003-03-18 | Denso Corporation | Voltage control apparatus for vehicle AC generator |
US9070793B2 (en) | 2010-08-02 | 2015-06-30 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having electromagnetic interference shielding and related methods |
WO2016067930A1 (en) * | 2014-10-29 | 2016-05-06 | 日立オートモティブシステムズ株式会社 | Electronic device and method for manufacturing electronic device |
JPWO2016067930A1 (en) * | 2014-10-29 | 2017-07-27 | 日立オートモティブシステムズ株式会社 | Electronic device and method for manufacturing electronic device |
CN107078100A (en) * | 2014-10-29 | 2017-08-18 | 日立汽车系统株式会社 | The manufacture method of electronic equipment and electronic equipment |
US10128164B2 (en) | 2014-10-29 | 2018-11-13 | Hitachi Automotive Systems, Ltd. | Electronic device and method of manufacturing the electronic device |
CN107078100B (en) * | 2014-10-29 | 2019-04-23 | 日立汽车系统株式会社 | The manufacturing method of electronic equipment and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
JPH0567069B2 (en) | 1993-09-24 |
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