JPS644052A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS644052A
JPS644052A JP15931487A JP15931487A JPS644052A JP S644052 A JPS644052 A JP S644052A JP 15931487 A JP15931487 A JP 15931487A JP 15931487 A JP15931487 A JP 15931487A JP S644052 A JPS644052 A JP S644052A
Authority
JP
Japan
Prior art keywords
leads
semiconductor chip
parts
metallic layers
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15931487A
Other languages
Japanese (ja)
Inventor
Shoichi Yamana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15931487A priority Critical patent/JPS644052A/en
Publication of JPS644052A publication Critical patent/JPS644052A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent aluminum on peds of a semiconductor chip from being removed, by forming metallic layers, larger in ionization tendency than a metal which forms leads, partially on the leads. CONSTITUTION:This device is composed of the following parts: an island 2 with a semiconductor chip 4 mounted on its central part, a lead frame 1a with a plurality of leads 3a formed spirally on the periphery of the island 2, sealing resin 6 formed for armoring the lead frame 1a and the semiconductor chip 4 other than tip parts of the leads 3a. Metallic layers 8 larger in ionization tendency than the lead 3a's metal are disposed on the leads 3a and in the vicinity of the bonding parts of the leads 3a by a coating method. Water, which invades gaps between the leads 3a and the sealing resin 6 and penetrates stepped parts 7, is made to chemically react to the metallic layers 8 and completely consumed. Since no water is thus carried through bonding wires 5 to reach the pads on a chip 4, aluminum on the pads can be prevented from being removed.
JP15931487A 1987-06-25 1987-06-25 Semiconductor device Pending JPS644052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15931487A JPS644052A (en) 1987-06-25 1987-06-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15931487A JPS644052A (en) 1987-06-25 1987-06-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS644052A true JPS644052A (en) 1989-01-09

Family

ID=15691089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15931487A Pending JPS644052A (en) 1987-06-25 1987-06-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS644052A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063105A (en) * 2015-09-24 2017-03-30 トヨタ自動車株式会社 Semiconductor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063105A (en) * 2015-09-24 2017-03-30 トヨタ自動車株式会社 Semiconductor module

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