JPS6133444U - 樹脂封止ｉｃ - Google Patents

樹脂封止ｉｃ

Info

Publication number
JPS6133444U
JPS6133444U JP11483684U JP11483684U JPS6133444U JP S6133444 U JPS6133444 U JP S6133444U JP 11483684 U JP11483684 U JP 11483684U JP 11483684 U JP11483684 U JP 11483684U JP S6133444 U JPS6133444 U JP S6133444U
Authority
JP
Japan
Prior art keywords
resin
chip
lead frame
view
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11483684U
Other languages
English (en)
Other versions
JPH0135477Y2 (ja
Inventor
博之 深澤
衡 坪根
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP11483684U priority Critical patent/JPS6133444U/ja
Publication of JPS6133444U publication Critical patent/JPS6133444U/ja
Application granted granted Critical
Publication of JPH0135477Y2 publication Critical patent/JPH0135477Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はこの考案の樹脂封止ＩＣの一実施例を示し、ａ
は断面図、ｂはａのｂ−ｂ線平面図、第２図は上記一実
施例のリードフレームアイランド部を取出して示す斜視
図、第３図は従来のフラントＩＣを示し、ａは平面図、
ｂは断面図、第４図は従来のフラットＩＣの他の狗を示
す断面図、第５図はフラットＩＣをプリント基板に搭載
する際の様子を示す斜視図、第６図ａ， ｂはパッケー
ジ全体を加熱してフラットＩＣを実装する方法を説明す
るための断面図、第７図ａ，ｂ，ｃはモールド樹脂に亀
裂が入った状態を示す図、第８図はこの考案の他の実施
例を示す断面図、第９図は他の実施例におけるアイラン
ド部を取出して示す斜視図である。 ２１・・・リードフレームのアイランド部、２３・・・
金属突起、２４・・・ＩＣチップ、２５・・・リードフ
レームの外部導出リード、２６・・・金属細線、２７・
・・モールド樹脂、２９・・・金属突起。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームのアイランド部上にＩＣチップを搭載し
    、芸のチップ表面の電極をリードフレームの外部導出リ
    ード比配線し、その配線部および前記ＩＣチップ部をモ
    ールド樹脂で封止してなる樹脂封止ＩＣにおいて、前記
    アイランド部の裏面に、先端が前記モールド樹脂部の表
    面に露出する金属突起を設けたことを特徴とする樹脂封
    止ＩＣ０
JP11483684U 1984-07-30 1984-07-30 樹脂封止ｉｃ Granted JPS6133444U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11483684U JPS6133444U (ja) 1984-07-30 1984-07-30 樹脂封止ｉｃ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11483684U JPS6133444U (ja) 1984-07-30 1984-07-30 樹脂封止ｉｃ

Publications (2)

Publication Number Publication Date
JPS6133444U true JPS6133444U (ja) 1986-02-28
JPH0135477Y2 JPH0135477Y2 (ja) 1989-10-30

Family

ID=30673834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11483684U Granted JPS6133444U (ja) 1984-07-30 1984-07-30 樹脂封止ｉｃ

Country Status (1)

Country Link
JP (1) JPS6133444U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555701A (en) * 1978-06-28 1980-01-16 Akihiko Shigemizu Concrete crusher
JPS6066839A (ja) * 1983-09-24 1985-04-17 Nec Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555701A (en) * 1978-06-28 1980-01-16 Akihiko Shigemizu Concrete crusher
JPS6066839A (ja) * 1983-09-24 1985-04-17 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0135477Y2 (ja) 1989-10-30

Similar Documents

Publication Publication Date Title
JPS5827934U (ja) 半導体装置
JPS6133444U (ja) 樹脂封止ｉｃ
JPS614436U (ja) 半導体装置用パツケ−ジ
JPS6081652U (ja) 樹脂封止型半導体装置
JPS60167345U (ja) 樹脂封止半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS6076045U (ja) 樹脂封止半導体装置
JPS6139950U (ja) 樹脂封止半導体装置
JPS6117747U (ja) 半導体装置の封止構造
JPS5878654U (ja) モ−ルド型半導体素子
JPS5856446U (ja) 樹脂封止半導体装置
JPS6027444U (ja) 樹脂封止形半導体装置
JPS6120058U (ja) 樹脂封止型半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS60144242U (ja) 樹脂封止集積回路
JPS6035546U (ja) 樹脂封止半導体装置
JPS5879781U (ja) Ｉｃ実装構造
JPS6096846U (ja) 半導体集積回路装置
JPS6037253U (ja) 半導体装置
JPS6068652U (ja) 半導体装置
JPS59180449U (ja) 半導体装置
JPS6094836U (ja) 半導体装置
JPS60149166U (ja) 混成集積回路装置
JPS5977264U (ja) 樹脂封止型半導体装置
JPS5869952U (ja) 樹脂封止半導体装置