JPS6139950U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS6139950U
JPS6139950U JP12531284U JP12531284U JPS6139950U JP S6139950 U JPS6139950 U JP S6139950U JP 12531284 U JP12531284 U JP 12531284U JP 12531284 U JP12531284 U JP 12531284U JP S6139950 U JPS6139950 U JP S6139950U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
semiconductor chip
encapsulated semiconductor
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12531284U
Other languages
English (en)
Other versions
JPH027469Y2 (ja
Inventor
裕 奥秋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP12531284U priority Critical patent/JPS6139950U/ja
Publication of JPS6139950U publication Critical patent/JPS6139950U/ja
Application granted granted Critical
Publication of JPH027469Y2 publication Critical patent/JPH027469Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はこの考案の樹脂封止半導体装置の一実施例を示
す断面図、第２図は従来の樹脂封止半導体装置を示す断
面図である。 １１・・・アイランド部、１２・・・半導体チップ、１
３・・・金属細線、１４・・・外部導出リード、１５・
・・封止樹脂、１６・・・ゴム状樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームのアイランド部上に半導体チップを搭載
    し、その半導体チップ表面の電極をリードフレームの外
    部導出リードに配線し、その配線部と半導体チップ部を
    モー、ルド成形の封止樹脂で封止するようにした樹脂封
    止半導代装置において、前記封止樹脂による封止は、前
    記アイランド部の裏側を除いて行い、アイランド部の裏
    側にはゴム状樹脂を充填することを特徴とする樹脂封止
    半導体装置。
JP12531284U 1984-08-20 1984-08-20 樹脂封止半導体装置 Granted JPS6139950U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12531284U JPS6139950U (ja) 1984-08-20 1984-08-20 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12531284U JPS6139950U (ja) 1984-08-20 1984-08-20 樹脂封止半導体装置

Publications (2)

Publication Number Publication Date
JPS6139950U true JPS6139950U (ja) 1986-03-13
JPH027469Y2 JPH027469Y2 (ja) 1990-02-22

Family

ID=30684001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12531284U Granted JPS6139950U (ja) 1984-08-20 1984-08-20 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6139950U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817630U (ja) * 1971-07-08 1973-02-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817630U (ja) * 1971-07-08 1973-02-28

Also Published As

Publication number Publication date
JPH027469Y2 (ja) 1990-02-22

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