JPS5883157U - 樹脂封止半導体装置 - Google Patents
樹脂封止半導体装置Info
- Publication number
- JPS5883157U JPS5883157U JP1981178184U JP17818481U JPS5883157U JP S5883157 U JPS5883157 U JP S5883157U JP 1981178184 U JP1981178184 U JP 1981178184U JP 17818481 U JP17818481 U JP 17818481U JP S5883157 U JPS5883157 U JP S5883157U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed
- encapsulated semiconductor
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の樹脂封止半導体装置の一例の断面図、第
2図は本考案の一実施例の断面図、第3図は本考案の他
の実施例の断面図である。 1−・・・・・金属フレーム、2・・・・・・半導体チ
ップ、3・・・・・・金属線、4・・・・・・樹脂、5
・・・・・・外部リード、6・・・・・・半田、7・・
・・・・金属フレーム1と樹脂4の境界部、8・・・・
・・金属フレーム1と外部リード5の境界部、9111
161ie8シリコン片。
2図は本考案の一実施例の断面図、第3図は本考案の他
の実施例の断面図である。 1−・・・・・金属フレーム、2・・・・・・半導体チ
ップ、3・・・・・・金属線、4・・・・・・樹脂、5
・・・・・・外部リード、6・・・・・・半田、7・・
・・・・金属フレーム1と樹脂4の境界部、8・・・・
・・金属フレーム1と外部リード5の境界部、9111
161ie8シリコン片。
Claims (1)
- 金属製のリードフレームに半導体チップを搭載し、金属
線で前記半導体チップの電極と外部リードとを接続し、
樹脂封止した樹脂封止半導体装置において、前記金属線
の一端と前記外部リードの接続点との間あるいは前記金
属線の他端と前記半導体チップの電極との間の少(とも
いづれか一方にシリコン片が設けられて樹脂封止されて
いることを特徴とする樹脂封止半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981178184U JPS5883157U (ja) | 1981-11-30 | 1981-11-30 | 樹脂封止半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981178184U JPS5883157U (ja) | 1981-11-30 | 1981-11-30 | 樹脂封止半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5883157U true JPS5883157U (ja) | 1983-06-06 |
Family
ID=29972749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981178184U Pending JPS5883157U (ja) | 1981-11-30 | 1981-11-30 | 樹脂封止半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5883157U (ja) |
-
1981
- 1981-11-30 JP JP1981178184U patent/JPS5883157U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5883157U (ja) | 樹脂封止半導体装置 | |
JPS5977241U (ja) | 樹脂封止型半導体装置 | |
JPS585347U (ja) | 樹脂封止型半導体装置 | |
JPS59145047U (ja) | 半導体装置 | |
JPS5856446U (ja) | 樹脂封止半導体装置 | |
JPS5945935U (ja) | 樹脂封止半導体装置 | |
JPS58153458U (ja) | 半導体装置 | |
JPS6142840U (ja) | 半導体装置 | |
JPS5895062U (ja) | 半導体装置 | |
JPS6073249U (ja) | 樹脂封止半導体装置 | |
JPS6139950U (ja) | 樹脂封止半導体装置 | |
JPS59180447U (ja) | 樹脂封止型半導体装置 | |
JPS6033452U (ja) | 樹脂封止型半導体装置 | |
JPS5954942U (ja) | 樹脂封止型半導体装置 | |
JPS5840843U (ja) | 樹脂封止型半導体装置 | |
JPS5811246U (ja) | 半導体装置 | |
JPS58155838U (ja) | 半導体装置 | |
JPS6068654U (ja) | 半導体装置 | |
JPS605137U (ja) | 半導体装置 | |
JPS58155849U (ja) | 半導体装置 | |
JPS60151132U (ja) | 半導体装置 | |
JPS6016553U (ja) | 樹脂封止型半導体装置 | |
JPS59176151U (ja) | 樹脂封止型半導体装置 | |
JPS59117166U (ja) | 樹脂封止型半導体装置 | |
JPS59195751U (ja) | 樹脂封止型半導体装置 |