JPS5887359U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5887359U
JPS5887359U JP1981183837U JP18383781U JPS5887359U JP S5887359 U JPS5887359 U JP S5887359U JP 1981183837 U JP1981183837 U JP 1981183837U JP 18383781 U JP18383781 U JP 18383781U JP S5887359 U JPS5887359 U JP S5887359U
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor equipment
metal wire
thin metal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981183837U
Other languages
English (en)
Inventor
幸孝 徳本
明 山岸
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981183837U priority Critical patent/JPS5887359U/ja
Publication of JPS5887359U publication Critical patent/JPS5887359U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例の横断面図、第２図は本案の一実施例を
示す横断面図、第３図は要部回路構成図である。 図中、１は放熱板、４は半導体素子、５はリード、５１
〜５６はリード片、５６□、５６２は分割片、６、　６
．、　６２は金属細線、７は樹脂材である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板に半導体素子を固定すると共に、それの電極と一
    端が半導体素子の近傍に位置するように配設されたり一
    ′ドとを金属細線にて接続し、かつ半導体素子を含む主
    要部分を樹脂材にてモールド被覆したものにおいて、上
    記リードのうち、グランド用リードの一端を複数に分割
    し、それぞれの分割片にそれぞれのグランド用電極から
    の金属細線を接続１７たことを特徴とする半導体装置。
JP1981183837U 1981-12-09 1981-12-09 半導体装置 Pending JPS5887359U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981183837U JPS5887359U (ja) 1981-12-09 1981-12-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981183837U JPS5887359U (ja) 1981-12-09 1981-12-09 半導体装置

Publications (1)

Publication Number Publication Date
JPS5887359U true JPS5887359U (ja) 1983-06-14

Family

ID=29983456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981183837U Pending JPS5887359U (ja) 1981-12-09 1981-12-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS5887359U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661410A (ja) * 1993-01-25 1994-03-04 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661410A (ja) * 1993-01-25 1994-03-04 Mitsubishi Electric Corp 半導体装置

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