JPS61240U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61240U
JPS61240U JP1984083901U JP8390184U JPS61240U JP S61240 U JPS61240 U JP S61240U JP 1984083901 U JP1984083901 U JP 1984083901U JP 8390184 U JP8390184 U JP 8390184U JP S61240 U JPS61240 U JP S61240U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
external leads
connection
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984083901U
Other languages
English (en)
Inventor
義弘 堀江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1984083901U priority Critical patent/JPS61240U/ja
Publication of JPS61240U publication Critical patent/JPS61240U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案Ω一実施例による平面図、第２図はその
要部断面図である。 １・・・・・・半導体素子、２・・・素子接続用タブ、
３・・・絶縁板又は絶縁フイルム、４・・・金属細線、
５・・・外部リード。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が搭載される素子接続用タブと、この半導体
    素子上の電極と金属細線で接続される多数の外部リード
    と前記素子接続用タブを前記外部リードの先端部に絶縁
    板または絶縁フイルムを介して接続する手段とを有する
    ことを特徴とする半導体装置。
JP1984083901U 1984-06-06 1984-06-06 半導体装置 Pending JPS61240U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984083901U JPS61240U (ja) 1984-06-06 1984-06-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984083901U JPS61240U (ja) 1984-06-06 1984-06-06 半導体装置

Publications (1)

Publication Number Publication Date
JPS61240U true JPS61240U (ja) 1986-01-06

Family

ID=30632944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984083901U Pending JPS61240U (ja) 1984-06-06 1984-06-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS61240U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238128A (ja) * 1988-03-18 1989-09-22 Nec Corp 樹脂封止型半導体装置
JPH03169693A (ja) * 1989-11-30 1991-07-23 Toshiba Corp カード状電子機器およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238128A (ja) * 1988-03-18 1989-09-22 Nec Corp 樹脂封止型半導体装置
JPH03169693A (ja) * 1989-11-30 1991-07-23 Toshiba Corp カード状電子機器およびその製造方法

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