JPS5895657U - 集積回路用リ−ドフレ−ム - Google Patents

集積回路用リ−ドフレ−ム

Info

Publication number
JPS5895657U
JPS5895657U JP19211881U JP19211881U JPS5895657U JP S5895657 U JPS5895657 U JP S5895657U JP 19211881 U JP19211881 U JP 19211881U JP 19211881 U JP19211881 U JP 19211881U JP S5895657 U JPS5895657 U JP S5895657U
Authority
JP
Japan
Prior art keywords
lead frame
integrated circuit
integrated circuits
tips
mounting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19211881U
Other languages
English (en)
Inventor
谷浦　隆
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP19211881U priority Critical patent/JPS5895657U/ja
Publication of JPS5895657U publication Critical patent/JPS5895657U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来（元）の集積回路用リードフレームの平面
図、第２図は第１図のリードフレームを用いて形成した
集積回路装置の断面図、第３図は本考案の一実施例の平
面図、第４図は第３図のリードフレームを用いて形成し
た集積回路装置の断面図、第５図は本考案の第２の実施
例のリードフレームを用いて形成した集積回路装置の断
面図、第６図は本考案の第３の実施例の平面図、第７図
は本考案の第４の実施例を用いて形成した集積回路装置
の断面図である。 １・・・・・・元のリードフレーム、２・・・・・・素
子搭載部、３・・・・・・リード、４・・・・・・支持
枠、５・・・・・・集積回路素子、６，１６・・・・・
・金属細線、８．　１８．　２８・・・・・・絶縁基板
、９，１９・・・・・・導電路。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体集積回路素子が搭載される素子搭載部と、この素
    子搭載部の周囲に先端が集るように配置された複数のリ
    ードと、前記複数のリード先端にそれぞれ接続され、こ
    のリード先端を前記素子搭載部に搭載される集積回路素
    子により一層近付けて導出する導電路の形成された絶縁
    基板とを備えたことを特徴とする集積回路用リードフレ
    ーム。
JP19211881U 1981-12-23 1981-12-23 集積回路用リ−ドフレ−ム Pending JPS5895657U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19211881U JPS5895657U (ja) 1981-12-23 1981-12-23 集積回路用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19211881U JPS5895657U (ja) 1981-12-23 1981-12-23 集積回路用リ−ドフレ−ム

Publications (1)

Publication Number Publication Date
JPS5895657U true JPS5895657U (ja) 1983-06-29

Family

ID=30105544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19211881U Pending JPS5895657U (ja) 1981-12-23 1981-12-23 集積回路用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5895657U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62232948A (ja) * 1986-04-03 1987-10-13 Sumitomo Metal Mining Co Ltd リ−ドフレ−ム
JPH0195760U (ja) * 1987-12-17 1989-06-26
JPH0258359A (ja) * 1988-08-24 1990-02-27 Ibiden Co Ltd 電子部品装置
JPH0277145A (ja) * 1988-09-13 1990-03-16 Ibiden Co Ltd 半導体装置
JPH0286158A (ja) * 1988-09-22 1990-03-27 Ibiden Co Ltd 配線基板付きリードフレームとその製造方法
JPH02178956A (ja) * 1988-12-29 1990-07-11 Nec Corp 樹脂封止型半導体装置
JPH0463154U (ja) * 1990-10-03 1992-05-29

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62232948A (ja) * 1986-04-03 1987-10-13 Sumitomo Metal Mining Co Ltd リ−ドフレ−ム
JPH0195760U (ja) * 1987-12-17 1989-06-26
JPH0258359A (ja) * 1988-08-24 1990-02-27 Ibiden Co Ltd 電子部品装置
JPH0277145A (ja) * 1988-09-13 1990-03-16 Ibiden Co Ltd 半導体装置
JPH0286158A (ja) * 1988-09-22 1990-03-27 Ibiden Co Ltd 配線基板付きリードフレームとその製造方法
JPH02178956A (ja) * 1988-12-29 1990-07-11 Nec Corp 樹脂封止型半導体装置
JPH0463154U (ja) * 1990-10-03 1992-05-29

Similar Documents

Publication Publication Date Title
JPS5895657U (ja) 集積回路用リ−ドフレ−ム
JPS58111958U (ja) 半導体装置のリ−ドフレ−ム
JP2562773Y2 (ja) 半導体集積回路素子
JPS61240U (ja) 半導体装置
JPS6094836U (ja) 半導体装置
JPS59182935U (ja) 半導体集積回路装置
JPS6066066U (ja) 半導体装置
JPS5856452U (ja) ハイブリツド型電子部品
JPS5839058U (ja) 半導体装置
JPS59125833U (ja) 半導体装置
JPS58155849U (ja) 半導体装置
JPS5918485U (ja) 電気部品アセンブリ−
JPS5878653U (ja) 半導体素子搭載用セラミツクパツケ−ジ
JPS5989551U (ja) 半導体集積回路装置
JPS5881940U (ja) 半導体素子の取付構造
JPS5958941U (ja) 半導体装置
JPS6138954U (ja) 半導体装置
JPS58189593U (ja) 回路素子集合体
JPS6059541U (ja) 集積回路用リ−ドフレ−ム
JPS5964249U (ja) サ−マルヘツド
JPS5999454U (ja) 集積回路の実装構造
JPS58170846U (ja) 半導体装置用リ−ドフレ−ム
JPS58182435U (ja) 半導体素子の外付け端子構造
JPS5945930U (ja) 半導体素子の実装構造
JPS62160556U (ja)