JPS62160556U - - Google Patents
Info
- Publication number
- JPS62160556U JPS62160556U JP1986049221U JP4922186U JPS62160556U JP S62160556 U JPS62160556 U JP S62160556U JP 1986049221 U JP1986049221 U JP 1986049221U JP 4922186 U JP4922186 U JP 4922186U JP S62160556 U JPS62160556 U JP S62160556U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- semiconductor
- integrated circuit
- circuit device
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は、本考案の一実施例による半導体集積
回路装置の断面図、第２図は、従来の半導体集積
回路装置の断面図である。 １……絶縁基板、２……回路配線層、３……金
属細線、４，５，６……半導体素子、７……導体
バンプ。
回路装置の断面図、第２図は、従来の半導体集積
回路装置の断面図である。 １……絶縁基板、２……回路配線層、３……金
属細線、４，５，６……半導体素子、７……導体
バンプ。
Claims (1)
- 絶縁基板上の搭載された複数の半導体素子と、
これら複数の半導体素子の上部にあつてその電極
端子が前記複数の半導体素子との接続されている
他の半導体素子とを有する事を特徴とした半導体
集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986049221U JPS62160556U (ja) | 1986-04-01 | 1986-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986049221U JPS62160556U (ja) | 1986-04-01 | 1986-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160556U true JPS62160556U (ja) | 1987-10-13 |
Family
ID=30871470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986049221U Pending JPS62160556U (ja) | 1986-04-01 | 1986-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160556U (ja) |
-
1986
- 1986-04-01 JP JP1986049221U patent/JPS62160556U/ja active Pending