JPS6263939U - - Google Patents

Info

Publication number
JPS6263939U
JPS6263939U JP15654785U JP15654785U JPS6263939U JP S6263939 U JPS6263939 U JP S6263939U JP 15654785 U JP15654785 U JP 15654785U JP 15654785 U JP15654785 U JP 15654785U JP S6263939 U JPS6263939 U JP S6263939U
Authority
JP
Japan
Prior art keywords
semiconductor device
insulating layer
metal wiring
dummy electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15654785U
Other languages
English (en)
Other versions
JPH041731Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15654785U priority Critical patent/JPH041731Y2/ja
Publication of JPS6263939U publication Critical patent/JPS6263939U/ja
Application granted granted Critical
Publication of JPH041731Y2 publication Critical patent/JPH041731Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係る半導体装置の断面図、第
2図はその平面図、第3図は従来例の断面図、第
4図は従来例の平面図である。 1……ダミー電極、2……絶縁層、3……金属
配線、4……コンタクト孔、5……基板。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上の絶縁層上に形成された金属配線構造を
    有する半導体装置において、 上記絶縁層の開口部に孤立したダミー電極が形
    成されており、上記金属配線が上記ダミー電極に
    接続されてなる半導体装置。
JP15654785U 1985-10-14 1985-10-14 Expired JPH041731Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15654785U JPH041731Y2 (ja) 1985-10-14 1985-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15654785U JPH041731Y2 (ja) 1985-10-14 1985-10-14

Publications (2)

Publication Number Publication Date
JPS6263939U true JPS6263939U (ja) 1987-04-21
JPH041731Y2 JPH041731Y2 (ja) 1992-01-21

Family

ID=31078263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15654785U Expired JPH041731Y2 (ja) 1985-10-14 1985-10-14

Country Status (1)

Country Link
JP (1) JPH041731Y2 (ja)

Also Published As

Publication number Publication date
JPH041731Y2 (ja) 1992-01-21

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