JPH0256460U - - Google Patents
Info
- Publication number
- JPH0256460U JPH0256460U JP13621388U JP13621388U JPH0256460U JP H0256460 U JPH0256460 U JP H0256460U JP 13621388 U JP13621388 U JP 13621388U JP 13621388 U JP13621388 U JP 13621388U JP H0256460 U JPH0256460 U JP H0256460U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- insulating
- hybrid integrated
- substrate
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は第１図の平面図、第３図及び第４図は従来例を
示す図である。 １……絶縁金属基板、２……大信号系半導体素
子、３……絶縁基板、４……小信号系半導体素子
、５，７……導体。
は第１図の平面図、第３図及び第４図は従来例を
示す図である。 １……絶縁金属基板、２……大信号系半導体素
子、３……絶縁基板、４……小信号系半導体素子
、５，７……導体。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 発熱を有する複数の大信号系の半導体素子
と発熱を有しない複数の小信号系の半導体素子と
が同一絶縁金属基板上に固着された混成集積回路
において、 前記複数の小信号系の半導体素子は絶縁基板を
介して固着されたことを特徴とする混成集積回路
。 (2) 前記絶縁基板上には所望形状の導体が形成
され、前記導体上に前記小信号系の半導体素子が
固着され、前記小信号系の半導体素子と前記導体
とがワイヤで接続されていることを特徴とする請
求項１記載の混成集積回路。 (3) 前記絶縁基板上に形成された導体と前記絶
縁金属基板上に形成された導体とはワイヤによつ
て接続されていることを特徴とする請求項１記載
の混成集積回路。 (4) 前記絶縁基板は絶縁処理されたアルミニウ
ム基板であることを特徴とする請求項１記載の混
成集積回路。 (5) 前記絶縁基板は前記絶縁金属基板とは接着
剤によつて接着されたことを特徴とする請求項１
記載の混成集積回路。 (6) 前記絶縁基板は前記絶縁金属基板上に絶縁
性接着剤で固着一体化されたことを特徴とする請
求項１記載の混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136213U JPH0636592Y2 (ja) | 1988-10-19 | 1988-10-19 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136213U JPH0636592Y2 (ja) | 1988-10-19 | 1988-10-19 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0256460U true JPH0256460U (ja) | 1990-04-24 |
| JPH0636592Y2 JPH0636592Y2 (ja) | 1994-09-21 |
Family
ID=31396510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988136213U Expired - Lifetime JPH0636592Y2 (ja) | 1988-10-19 | 1988-10-19 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636592Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013110354A (ja) * | 2011-11-24 | 2013-06-06 | Keihin Corp | 電子制御装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6241594U (ja) * | 1985-04-26 | 1987-03-12 |
-
1988
- 1988-10-19 JP JP1988136213U patent/JPH0636592Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6241594U (ja) * | 1985-04-26 | 1987-03-12 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013110354A (ja) * | 2011-11-24 | 2013-06-06 | Keihin Corp | 電子制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0636592Y2 (ja) | 1994-09-21 |