JPS6398653U - - Google Patents
Info
- Publication number
- JPS6398653U JPS6398653U JP1986194762U JP19476286U JPS6398653U JP S6398653 U JPS6398653 U JP S6398653U JP 1986194762 U JP1986194762 U JP 1986194762U JP 19476286 U JP19476286 U JP 19476286U JP S6398653 U JPS6398653 U JP S6398653U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- insulating film
- film
- bent
- conductive path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
乃至第５図は従来例の図である。 １……金属基板、２……絶縁フイルム、３……
剥離膜。
乃至第５図は従来例の図である。 １……金属基板、２……絶縁フイルム、３……
剥離膜。
Claims (1)
- 二枚の金属基板と、前記金属基板を離間して結
合する絶縁フイルムと、前記フイルム上に設けた
所望形状の導電路と、前記導電路上に固着される
少なくとも発熱を有する複数の回路素子とを具備
し、前記金属基板間の絶縁フイルムを折曲し前記
回路素子が対向する様に配置した混成集積回路に
おいて、前記絶縁フイルムが折り曲げされる二枚
の金属基板の周端部に剥離膜を備えることを特徴
とする混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986194762U JPH0442938Y2 (ja) | 1986-12-18 | 1986-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986194762U JPH0442938Y2 (ja) | 1986-12-18 | 1986-12-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6398653U true JPS6398653U (ja) | 1988-06-25 |
| JPH0442938Y2 JPH0442938Y2 (ja) | 1992-10-12 |
Family
ID=31152034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986194762U Expired JPH0442938Y2 (ja) | 1986-12-18 | 1986-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442938Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0420265U (ja) * | 1990-06-13 | 1992-02-20 |
-
1986
- 1986-12-18 JP JP1986194762U patent/JPH0442938Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0420265U (ja) * | 1990-06-13 | 1992-02-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442938Y2 (ja) | 1992-10-12 |