JPS62116545U - - Google Patents
Info
- Publication number
- JPS62116545U JPS62116545U JP438186U JP438186U JPS62116545U JP S62116545 U JPS62116545 U JP S62116545U JP 438186 U JP438186 U JP 438186U JP 438186 U JP438186 U JP 438186U JP S62116545 U JPS62116545 U JP S62116545U
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- insulating film
- conductive path
- metal substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
Ａ乃至第２図Ｃは本実施例の製造方法を示す断面
図、第３図は従来例を示す断面図である。 １，２……金属基板、３……絶縁フイルム、４
……導電路、５……回路素子、６……銅箔、７…
…外部リード、８……突出部。
Ａ乃至第２図Ｃは本実施例の製造方法を示す断面
図、第３図は従来例を示す断面図である。 １，２……金属基板、３……絶縁フイルム、４
……導電路、５……回路素子、６……銅箔、７…
…外部リード、８……突出部。
Claims (1)
- プレス打抜きで離間して配置した二枚の金属基
板と、該金属基板のプレス打抜面側に前記金属基
板を離間して結合する絶縁フイルムと、該フイル
ム上に設けた所望形状の導電路と、該導電路上に
固着される複数の回路素子とを具備し、両基板間
の絶縁フイルムを曲折して前記基板の反対主面を
接する様に配置することを特徴とする混成集積回
路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP438186U JPH0423321Y2 (ja) | 1986-01-16 | 1986-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP438186U JPH0423321Y2 (ja) | 1986-01-16 | 1986-01-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62116545U true JPS62116545U (ja) | 1987-07-24 |
| JPH0423321Y2 JPH0423321Y2 (ja) | 1992-05-29 |
Family
ID=30784995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP438186U Expired JPH0423321Y2 (ja) | 1986-01-16 | 1986-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423321Y2 (ja) |
-
1986
- 1986-01-16 JP JP438186U patent/JPH0423321Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423321Y2 (ja) | 1992-05-29 |