JPH01135736U - - Google Patents

Info

Publication number
JPH01135736U
JPH01135736U JP3109188U JP3109188U JPH01135736U JP H01135736 U JPH01135736 U JP H01135736U JP 3109188 U JP3109188 U JP 3109188U JP 3109188 U JP3109188 U JP 3109188U JP H01135736 U JPH01135736 U JP H01135736U
Authority
JP
Japan
Prior art keywords
hole
semiconductor pellet
metal plate
insulating substrate
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3109188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3109188U priority Critical patent/JPH01135736U/ja
Publication of JPH01135736U publication Critical patent/JPH01135736U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
従来技術による例の断面図である。 １……絶縁基板、２……金属板、３……半導体
ペレツト、４……接続線、５……搭載部品、６…
…リード端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 貫通孔を有する絶縁基板と、該貫通孔を塞いで
    絶縁基板と貼り合わされた金属板と、該金属板上
    に貼り合わされかつ該貫通孔中に設けられた半導
    体ペレツトとを有し、絶縁基板上に形成した回路
    と半導体ペレツトをワイヤボンデイング等の手法
    により接続したことを特徴とする混成集積回路装
    置。
JP3109188U 1988-03-08 1988-03-08 Pending JPH01135736U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3109188U JPH01135736U (ja) 1988-03-08 1988-03-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3109188U JPH01135736U (ja) 1988-03-08 1988-03-08

Publications (1)

Publication Number Publication Date
JPH01135736U true JPH01135736U (ja) 1989-09-18

Family

ID=31256700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3109188U Pending JPH01135736U (ja) 1988-03-08 1988-03-08

Country Status (1)

Country Link
JP (1) JPH01135736U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992002117A1 (en) * 1990-07-26 1992-02-06 Fujitsu Limited Heat dissipating structure of semiconductor device
GB2252451A (en) * 1990-07-26 1992-08-05 Fujitsu Ltd Heat dissipating structure of semiconductor device
US5262922A (en) * 1990-07-26 1993-11-16 Fujitsu, Limited Heat radiation structure for semiconductor device
GB2252451B (en) * 1990-07-26 1995-01-04 Fujitsu Ltd Heat radiation structure for semiconductor device

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