JPS59119033U - 絶縁型半導体装置 - Google Patents

絶縁型半導体装置

Info

Publication number
JPS59119033U
JPS59119033U JP1341183U JP1341183U JPS59119033U JP S59119033 U JPS59119033 U JP S59119033U JP 1341183 U JP1341183 U JP 1341183U JP 1341183 U JP1341183 U JP 1341183U JP S59119033 U JPS59119033 U JP S59119033U
Authority
JP
Japan
Prior art keywords
semiconductor device
isolated semiconductor
lead
semiconductor pellet
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1341183U
Other languages
English (en)
Inventor
祐史 富田
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1341183U priority Critical patent/JPS59119033U/ja
Publication of JPS59119033U publication Critical patent/JPS59119033U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は基板連及びリードフレームを示す概略平面図、
第２図及び第３図は従来の絶縁型半導体装置を示す側断
面図及び平面図、第４図は本考案の一実施例を示す絶縁
型半導体装置の側断面図、第５図はリード側面図及び平
面図、第６図は製造方法の一例を示す側断面図である。 １・・・基板、７・・・絶縁板、８・・・半導体ペレッ
ト、１１．１１’・・・リード、１２・・・半導体ペレ
ット載置部、１３・・・延設部、１５・・・貫通穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上に絶縁板、リード中間部、半導体ペレットを順次
    積層固定し、上記リードの半導体ペレット載置部と一端
    部との間に貫通穴を穿設したことを特徴とする絶縁型半
    導体装置。
JP1341183U 1983-01-31 1983-01-31 絶縁型半導体装置 Pending JPS59119033U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1341183U JPS59119033U (ja) 1983-01-31 1983-01-31 絶縁型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1341183U JPS59119033U (ja) 1983-01-31 1983-01-31 絶縁型半導体装置

Publications (1)

Publication Number Publication Date
JPS59119033U true JPS59119033U (ja) 1984-08-11

Family

ID=30144796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1341183U Pending JPS59119033U (ja) 1983-01-31 1983-01-31 絶縁型半導体装置

Country Status (1)

Country Link
JP (1) JPS59119033U (ja)

Similar Documents

Publication Publication Date Title
JPS59119033U (ja) 絶縁型半導体装置
JPS5858342U (ja) 混成集積回路
JPS5920632U (ja) 半導体装置
JPS5899841U (ja) 半導体装置
JPS59176154U (ja) 混成集積回路装置
JPS5952665U (ja) 混成集積回路
JPS5954951U (ja) 半導体装置
JPS5881940U (ja) 半導体素子の取付構造
JPS6094836U (ja) 半導体装置
JPS593556U (ja) 半導体装置
JPS59171372U (ja) 薄型回路基板
JPS5970354U (ja) 半導体装置の外部リ−ド取付用治具
JPS6094835U (ja) 半導体装置
JPS5939930U (ja) 半導体装置の組立て基板
JPS60153544U (ja) スイツチング回路を組込んだ混成集積回路装置
JPS58191637U (ja) 半導体装置用内部接続端子
JPS59138237U (ja) 半導体装置
JPS6083278U (ja) 多層配線構造
JPS6138954U (ja) 半導体装置
JPS59173367U (ja) 磁性部品の取付装置
JPS58160431U (ja) スイツチの電極パタ−ン
JPS611852U (ja) 複合半導体装置
JPS6127347U (ja) 半導体装置
JPS60106350U (ja) 外部リ−ド端子の取付構造
JPS60163744U (ja) 半導体集積回路装置