JPS5920632U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5920632U
JPS5920632U JP11540782U JP11540782U JPS5920632U JP S5920632 U JPS5920632 U JP S5920632U JP 11540782 U JP11540782 U JP 11540782U JP 11540782 U JP11540782 U JP 11540782U JP S5920632 U JPS5920632 U JP S5920632U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
insulating substrate
lead
view
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11540782U
Other languages
English (en)
Inventor
哲雄 市川
筧　二朗
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP11540782U priority Critical patent/JPS5920632U/ja
Publication of JPS5920632U publication Critical patent/JPS5920632U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は絶縁型半導体装置の一例を示す一部透視平面図
、第２図は第１図側断面図、第３図は第１図半導体装置
に用いられる基板連並びにリードフレームの平面図、第
４図は第１図半導体装置の問題点を説明するための一部
透視平面図、第５図は第４図側臥面図、第６図は本考案
の一実施例を示す一部透視平面図、第７図は第６図側臥
面図、第８図は絶縁基板の一例を示す斜視図、第９図は
第７図の要部拡大図、第１０図は本考案の他の実施例を
示す要部拡大図である。 １２・・・金属基板、１３・・・絶縁基板、１５・・・
リード、１５ｂ・・・タブ、１６・・・半導体ペレット
、１３ａ、１５Ｃ・・・係合部。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード端部を絶縁基板を介して金属基板上に固定し、上
    記リード端部上に半導体ペレットを載置したものにおい
    て、上記リードと絶縁基板に位置決め用係合部を形成し
    たことを特徴とする半導体装置。
JP11540782U 1982-07-28 1982-07-28 半導体装置 Pending JPS5920632U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11540782U JPS5920632U (ja) 1982-07-28 1982-07-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11540782U JPS5920632U (ja) 1982-07-28 1982-07-28 半導体装置

Publications (1)

Publication Number Publication Date
JPS5920632U true JPS5920632U (ja) 1984-02-08

Family

ID=30266411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11540782U Pending JPS5920632U (ja) 1982-07-28 1982-07-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS5920632U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124847A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 連続式高温強度試験機
JPS61124848A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd セラミックス部材曲げ試験機用供試体収納治具及び該供試体収納治具を備えたセラミックス部材曲げ試験機

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124847A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 連続式高温強度試験機
JPS61124848A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd セラミックス部材曲げ試験機用供試体収納治具及び該供試体収納治具を備えたセラミックス部材曲げ試験機

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