JPS5883149U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5883149U
JPS5883149U JP1981179740U JP17974081U JPS5883149U JP S5883149 U JPS5883149 U JP S5883149U JP 1981179740 U JP1981179740 U JP 1981179740U JP 17974081 U JP17974081 U JP 17974081U JP S5883149 U JPS5883149 U JP S5883149U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
pellet
electrode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981179740U
Other languages
English (en)
Other versions
JPS6334268Y2 (ja
Inventor
熊野　省治
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981179740U priority Critical patent/JPS5883149U/ja
Publication of JPS5883149U publication Critical patent/JPS5883149U/ja
Application granted granted Critical
Publication of JPS6334268Y2 publication Critical patent/JPS6334268Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は、従来の半導体装置のペレットマウ
ント構体要部平面図、第３図は、この考案の実施例を示
す半導体装置のベレットマウント構体要部平面図、第４
図７第７図は、そのペレット表面処理を説明するための
ウェーハ断面図である。 ２．３・・・・・・表面電極、４・・・・・・ペレット
、１２゜１３．１４・・・・・・マーキング。

Claims (1)

    【実用新案登録請求の範囲】
  1. ペレットの表面電極上に、電極縁部より複数個半島状に
    延ばした絶縁被膜製のマーキングを設けたことを特徴と
    する半導体装置。
JP1981179740U 1981-11-30 1981-11-30 半導体装置 Granted JPS5883149U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981179740U JPS5883149U (ja) 1981-11-30 1981-11-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981179740U JPS5883149U (ja) 1981-11-30 1981-11-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS5883149U true JPS5883149U (ja) 1983-06-06
JPS6334268Y2 JPS6334268Y2 (ja) 1988-09-12

Family

ID=29975706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981179740U Granted JPS5883149U (ja) 1981-11-30 1981-11-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS5883149U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010074499A (ja) * 2008-09-18 2010-04-02 Panasonic Electric Works Co Ltd リレー装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010074499A (ja) * 2008-09-18 2010-04-02 Panasonic Electric Works Co Ltd リレー装置

Also Published As

Publication number Publication date
JPS6334268Y2 (ja) 1988-09-12

Similar Documents

Publication Publication Date Title
JPS5883149U (ja) 半導体装置
JPS596839U (ja) 半導体装置
JPS5888239U (ja) 半導体装置用マスク
JPS592159U (ja) トランジスタ装置
JPS5920632U (ja) 半導体装置
JPS5846444U (ja) 半導体装置
JPS5954960U (ja) 半導体装置の電極構造
JPS5984834U (ja) 半導体基板
JPS5983029U (ja) 半導体基板
JPS5825039U (ja) 半導体基板
JPS5881938U (ja) 半導体装置
JPS5984835U (ja) 半導体ペレツト
JPS587336U (ja) 薄膜集積回路装置
JPS593556U (ja) 半導体装置
JPS6094836U (ja) 半導体装置
JPS5983052U (ja) 半導体装置
JPS58120661U (ja) 半導体装置
JPS6134733U (ja) 半導体ウエハ
JPS5936263U (ja) 半導体装置
JPS6094835U (ja) 半導体装置
JPS5963916U (ja) フレキシブルケ−ブル
JPS6142861U (ja) 半導体装置
JPS60136155U (ja) 半導体装置
JPS58109248U (ja) 半導体素子
JPS58131526U (ja) 摺動用導電体