JPS62147344U - - Google Patents

Info

Publication number
JPS62147344U
JPS62147344U JP3521986U JP3521986U JPS62147344U JP S62147344 U JPS62147344 U JP S62147344U JP 3521986 U JP3521986 U JP 3521986U JP 3521986 U JP3521986 U JP 3521986U JP S62147344 U JPS62147344 U JP S62147344U
Authority
JP
Japan
Prior art keywords
metal layer
base metal
bump electrode
wiring metal
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3521986U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3521986U priority Critical patent/JPS62147344U/ja
Publication of JPS62147344U publication Critical patent/JPS62147344U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は、本考案の一実施例のバンプ電極部を
示し、aは断面図、bは上面図、第2図は従来の
バンプ電極部を示し、同様にaが断面図、bが上
面図である。 1:シリコンチツプ、2:酸化膜、3:Al配
線、4:窒化膜、6:下地金属層、7:バンプ電
極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 端子導体に接続されるバンプ電極が半導体片上
    の配線金属層と下地金属層を介して接触するもの
    において、配線金属層が下地金属層の周縁部の下
    より外まで延在することを特徴とする半導体素子
JP3521986U 1986-03-11 1986-03-11 Pending JPS62147344U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3521986U JPS62147344U (ja) 1986-03-11 1986-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3521986U JPS62147344U (ja) 1986-03-11 1986-03-11

Publications (1)

Publication Number Publication Date
JPS62147344U true JPS62147344U (ja) 1987-09-17

Family

ID=30844508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3521986U Pending JPS62147344U (ja) 1986-03-11 1986-03-11

Country Status (1)

Country Link
JP (1) JPS62147344U (ja)

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