JPS6298242U - - Google Patents

Info

Publication number
JPS6298242U
JPS6298242U JP18984985U JP18984985U JPS6298242U JP S6298242 U JPS6298242 U JP S6298242U JP 18984985 U JP18984985 U JP 18984985U JP 18984985 U JP18984985 U JP 18984985U JP S6298242 U JPS6298242 U JP S6298242U
Authority
JP
Japan
Prior art keywords
lead
semiconductor chip
fixed
terminal part
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18984985U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18984985U priority Critical patent/JPS6298242U/ja
Publication of JPS6298242U publication Critical patent/JPS6298242U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の１実施例の断面図、第２図は
その平面図、第３図は別の実施例の平面図である
。 １：ＩＣチツプ、２：バンプ電極、３：リード
導体、４：絶縁膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプの接続端子部に外部接続のための
    リードが固着されるものにおいて、端子部と接触
    する部分を除く他の部分が絶縁膜で被覆されてい
    るリードが固着されたことを特徴とする半導体集
    積回路。
JP18984985U 1985-12-10 1985-12-10 Pending JPS6298242U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18984985U JPS6298242U (ja) 1985-12-10 1985-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18984985U JPS6298242U (ja) 1985-12-10 1985-12-10

Publications (1)

Publication Number Publication Date
JPS6298242U true JPS6298242U (ja) 1987-06-23

Family

ID=31142516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18984985U Pending JPS6298242U (ja) 1985-12-10 1985-12-10

Country Status (1)

Country Link
JP (1) JPS6298242U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629348A (ja) * 1992-05-12 1994-02-04 Akira Kitahara 表面実装部品及びその半製品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313877A (en) * 1976-07-23 1978-02-07 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5313877A (en) * 1976-07-23 1978-02-07 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629348A (ja) * 1992-05-12 1994-02-04 Akira Kitahara 表面実装部品及びその半製品

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