JPS596843U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS596843U
JPS596843U JP1982101607U JP10160782U JPS596843U JP S596843 U JPS596843 U JP S596843U JP 1982101607 U JP1982101607 U JP 1982101607U JP 10160782 U JP10160782 U JP 10160782U JP S596843 U JPS596843 U JP S596843U
Authority
JP
Japan
Prior art keywords
semiconductor device
lead
semiconductor equipment
diode chip
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982101607U
Other languages
English (en)
Inventor
和夫 松本
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982101607U priority Critical patent/JPS596843U/ja
Publication of JPS596843U publication Critical patent/JPS596843U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のリードレス２端子半導体装置の斜視図、
第２図は、第１図装置の断面図、第３図は２端子半導体
装置の等価回路図、第４図は本考案の一実施例の一部分
を破断して示す斜視図、第５図は第４図の実施例の平板
リードと金属電極の接続の変形例を示す斜視図、第６図
と第７図はそれぞれ本考案に係−る半導体装置のパッケ
ージ外形の変形例を示す図である。 １・・・・・・ガテスパッケージ、２・・・・・・円柱
状金属電極、３・・・・・・ダイオードチップ、４ａ、
　　４ｂ、　　１４・・・・・・平板のリード、５・・
・・・・金属細線、＝６．１６゜２６・・・・・・プラ
スチックパッケージ、７ａ、　　７ｂ。 １１ａ、　　８ｂ、　　９ａ、　　９ｂ・・・・・・環
状金属電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. ダイオードチップの両電極にそれぞれ接続され同一面で
    互いに反対方向に引き出された平板のリードと、前記ダ
    イオードチップおよび平板のリードを覆うプラスチック
    のパッケージと、このパッケージの両端の外周を覆い前
    記平板のリードとつながっている金属電極とを含むこと
    を特徴とする半導体装置。
JP1982101607U 1982-07-05 1982-07-05 半導体装置 Pending JPS596843U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982101607U JPS596843U (ja) 1982-07-05 1982-07-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982101607U JPS596843U (ja) 1982-07-05 1982-07-05 半導体装置

Publications (1)

Publication Number Publication Date
JPS596843U true JPS596843U (ja) 1984-01-17

Family

ID=30239871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982101607U Pending JPS596843U (ja) 1982-07-05 1982-07-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS596843U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013262A1 (ja) * 2005-07-28 2007-02-01 Sumitomo Wiring Systems, Ltd. 太陽電池モジュール用端子ボックス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013262A1 (ja) * 2005-07-28 2007-02-01 Sumitomo Wiring Systems, Ltd. 太陽電池モジュール用端子ボックス

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