JPS58170835U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58170835U JPS58170835U JP6842382U JP6842382U JPS58170835U JP S58170835 U JPS58170835 U JP S58170835U JP 6842382 U JP6842382 U JP 6842382U JP 6842382 U JP6842382 U JP 6842382U JP S58170835 U JPS58170835 U JP S58170835U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- block body
- electrode
- semiconductor
- integrally formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案の一実施例の要部を示す斜視図である。
１・・・ブロック体、２． ６． ７・・・接続導体、
３・・・半導体チップ、４．５・・・端子体、８・・・
接続導線。
３・・・半導体チップ、４．５・・・端子体、８・・・
接続導線。
Claims (1)
- 薄い接続導体と同一材料で一体に形成された厚いブロッ
ク体上に固定された半導体素体の電極と、同様に薄い接
続導体と同一材料で一体に形成され、前記ブロック体と
同じ厚さを有する端子体の上面とが導線によって接続さ
れたことを特徴きする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6842382U JPS58170835U (ja) | 1982-05-11 | 1982-05-11 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6842382U JPS58170835U (ja) | 1982-05-11 | 1982-05-11 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58170835U true JPS58170835U (ja) | 1983-11-15 |
Family
ID=30078206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6842382U Pending JPS58170835U (ja) | 1982-05-11 | 1982-05-11 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170835U (ja) |
-
1982
- 1982-05-11 JP JP6842382U patent/JPS58170835U/ja active Pending
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