JPS602832U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS602832U JPS602832U JP1983094705U JP9470583U JPS602832U JP S602832 U JPS602832 U JP S602832U JP 1983094705 U JP1983094705 U JP 1983094705U JP 9470583 U JP9470583 U JP 9470583U JP S602832 U JPS602832 U JP S602832U
- Authority
- JP
- Japan
- Prior art keywords
- emitter
- electrode
- semiconductor equipment
- sides
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来のパワートランジスタの平面図、第２図は
本考案の一実施例のパワートランジスタの平面図である
。 １・・・シリコンチップ、２・・・ベース電極、３１゜
３２・・・エミッタ電極、７１．７２・・・エミッタリ
ード線、８・・・エミッタ端子。
本考案の一実施例のパワートランジスタの平面図である
。 １・・・シリコンチップ、２・・・ベース電極、３１゜
３２・・・エミッタ電極、７１．７２・・・エミッタリ
ード線、８・・・エミッタ端子。
Claims (1)
- 半導体素体の表面の中央部にベース電極、その両側にエ
ミッタ電極を有するものにおいて、半導体素体のエミッ
タ電極が位置する側と同じ両側に互に連結されたエミッ
タ端子が設けられ、該各エミッタ端子がそれぞれ近くに
位置するニーミッタ電極とほぼ等しい長さのエミッタリ
ード線によって接続されたことを特徴とする半導体装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983094705U JPS602832U (ja) | 1983-06-20 | 1983-06-20 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983094705U JPS602832U (ja) | 1983-06-20 | 1983-06-20 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS602832U true JPS602832U (ja) | 1985-01-10 |
Family
ID=30226555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983094705U Pending JPS602832U (ja) | 1983-06-20 | 1983-06-20 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602832U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296632A (ja) * | 1988-05-25 | 1989-11-30 | Mitsubishi Electric Corp | 半導体装置 |
| JP2006210786A (ja) * | 2005-01-31 | 2006-08-10 | Matsushita Electric Ind Co Ltd | トランジスタ |
-
1983
- 1983-06-20 JP JP1983094705U patent/JPS602832U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296632A (ja) * | 1988-05-25 | 1989-11-30 | Mitsubishi Electric Corp | 半導体装置 |
| JP2006210786A (ja) * | 2005-01-31 | 2006-08-10 | Matsushita Electric Ind Co Ltd | トランジスタ |
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