JPS5829846U - チツプ型トランジスタ - Google Patents

チツプ型トランジスタ

Info

Publication number
JPS5829846U
JPS5829846U JP12360081U JP12360081U JPS5829846U JP S5829846 U JPS5829846 U JP S5829846U JP 12360081 U JP12360081 U JP 12360081U JP 12360081 U JP12360081 U JP 12360081U JP S5829846 U JPS5829846 U JP S5829846U
Authority
JP
Japan
Prior art keywords
terminal
terminals
main body
straight line
same straight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12360081U
Other languages
English (en)
Other versions
JPS6225904Y2 (ja
Inventor
浩 北原
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP12360081U priority Critical patent/JPS5829846U/ja
Publication of JPS5829846U publication Critical patent/JPS5829846U/ja
Application granted granted Critical
Publication of JPS6225904Y2 publication Critical patent/JPS6225904Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Amplifiers (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例におけるチップ型トランジスタ、の構成
を示す図、第２図は同トランジスタの使用例を示す回路
図、第３図は本考案の一実施例におけるチップ型トラン
ジスタの構成を示す図、第４図は同トランジスタの特に
端子構成を説明す名ための図、第５図は同トランジスタ
の使用例を示す回路図である。 １θ・・・・・・トランジスタチップ、１１・・・・・
・パッケージ本体、１２・・・・・・ベース端子、１３
．１３’・・・・・・エミッタ端子１．１４・・・・・
・コレクタ端子。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）トランジスタチップを内蔵する本体の一面より第
    １、第２の端子を互いに平行に突出し、この−面と相対
    向する面より第３、第４の端子を互いに平行に突出し、
    かつ前記第１、第３の端子を同一直線上に位置するよう
    に、第２、第４の端子を同一直線上に位置するようにそ
    れぞれ装置し、前記第１の端子と第４の端子は同−電、
    　　極とし、前記第２、第３の端子は互いに異なりかつ
    ともに前記第１、第４の端子とは異なる電極としてなる
    チップ型トランジスタ。
  2. （２）第１の端子と第４の端子を、第２の端子と第３の
    端子との間に位置する導電体により本体において電気的
    に接続してなる実用新案登録請求の範囲第１項記載のチ
    ップ型トランジスタ。 ゛（３）第１の端子と第４の端子は本体内において電気
    的に分離され、プリント基板上のパターンにより電気的
    に接続される実用新案登録請求の範囲第１項記載のチッ
    プ型トランジスタ。
JP12360081U 1981-08-20 1981-08-20 チツプ型トランジスタ Granted JPS5829846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12360081U JPS5829846U (ja) 1981-08-20 1981-08-20 チツプ型トランジスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12360081U JPS5829846U (ja) 1981-08-20 1981-08-20 チツプ型トランジスタ

Publications (2)

Publication Number Publication Date
JPS5829846U true JPS5829846U (ja) 1983-02-26
JPS6225904Y2 JPS6225904Y2 (ja) 1987-07-02

Family

ID=29917498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12360081U Granted JPS5829846U (ja) 1981-08-20 1981-08-20 チツプ型トランジスタ

Country Status (1)

Country Link
JP (1) JPS5829846U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113955A (ja) * 1983-11-25 1985-06-20 Hitachi Ltd シングル・ゲート型ＧａＡｓＦＥＴ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910463U (ja) * 1972-04-28 1974-01-29
JPS5247382A (en) * 1975-10-13 1977-04-15 Toshiba Corp Varactor diode device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910463U (ja) * 1972-04-28 1974-01-29
JPS5247382A (en) * 1975-10-13 1977-04-15 Toshiba Corp Varactor diode device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113955A (ja) * 1983-11-25 1985-06-20 Hitachi Ltd シングル・ゲート型ＧａＡｓＦＥＴ

Also Published As

Publication number Publication date
JPS6225904Y2 (ja) 1987-07-02

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