JPS6338328U - - Google Patents

Info

Publication number
JPS6338328U
JPS6338328U JP1986131950U JP13195086U JPS6338328U JP S6338328 U JPS6338328 U JP S6338328U JP 1986131950 U JP1986131950 U JP 1986131950U JP 13195086 U JP13195086 U JP 13195086U JP S6338328 U JPS6338328 U JP S6338328U
Authority
JP
Japan
Prior art keywords
electrode
connection wiring
wiring
contact hole
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986131950U
Other languages
English (en)
Other versions
JPH0436114Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986131950U priority Critical patent/JPH0436114Y2/ja
Publication of JPS6338328U publication Critical patent/JPS6338328U/ja
Application granted granted Critical
Publication of JPH0436114Y2 publication Critical patent/JPH0436114Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0235—Shape of the redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体チツプの平
面図、第２図はその接続配線の拡大平面図、第３
図は接続配線部の断面図である。 １：チツプ、２：絶縁膜、３：接続用バンプ電
極、４：取出しバンプ、５：接続配線、７：電極
配線、９：はんだ層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプ上の電極配線に絶縁膜に開けられ
    たコンタクト穴において接続される実装のための
    バンプ電極を有するものにおいて、一端がコンタ
    クト穴において電極配線に接触し他端がチツプの
    中央部に位置する接続配線が設けられ、該接続配
    線の他端上にバンプ電極を備え、それ以外の接続
    配線部分もはんだにより被覆されたことを特徴と
    する半導体集積回路。
JP1986131950U 1986-08-28 1986-08-28 Expired JPH0436114Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986131950U JPH0436114Y2 (ja) 1986-08-28 1986-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986131950U JPH0436114Y2 (ja) 1986-08-28 1986-08-28

Publications (2)

Publication Number Publication Date
JPS6338328U true JPS6338328U (ja) 1988-03-11
JPH0436114Y2 JPH0436114Y2 (ja) 1992-08-26

Family

ID=31030878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986131950U Expired JPH0436114Y2 (ja) 1986-08-28 1986-08-28

Country Status (1)

Country Link
JP (1) JPH0436114Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276748A (ja) * 1988-04-28 1989-11-07 Fuji Electric Co Ltd 半導体素子の突起電極
JP2014068015A (ja) * 2012-09-25 2014-04-17 Samsung Electronics Co Ltd バンプ構造体、電気的接続構造体、及びその形成方法
JP2015228472A (ja) * 2014-06-03 2015-12-17 株式会社ソシオネクスト 半導体装置およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276748A (ja) * 1988-04-28 1989-11-07 Fuji Electric Co Ltd 半導体素子の突起電極
JP2014068015A (ja) * 2012-09-25 2014-04-17 Samsung Electronics Co Ltd バンプ構造体、電気的接続構造体、及びその形成方法
JP2015228472A (ja) * 2014-06-03 2015-12-17 株式会社ソシオネクスト 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPH0436114Y2 (ja) 1992-08-26

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