JPS58158453U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58158453U
JPS58158453U JP5611982U JP5611982U JPS58158453U JP S58158453 U JPS58158453 U JP S58158453U JP 5611982 U JP5611982 U JP 5611982U JP 5611982 U JP5611982 U JP 5611982U JP S58158453 U JPS58158453 U JP S58158453U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor element
resin material
lead
lead piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5611982U
Other languages
English (en)
Inventor
「あ」田　秀雄
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP5611982U priority Critical patent/JPS58158453U/ja
Publication of JPS58158453U publication Critical patent/JPS58158453U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例の横断面図、第２図は第１図の側断面図
、第３図はリードの放熱板へのかしめ方法を説明するた
めの横断面図、第４図は第３図ａの側断面図、第５図は
本案の一実施例を示す横断面図、第６図は第５図の側断
面図である。 図中、１は放熱板、３は半導体素子、４はリード、４１
〜４３はリード片、５は第１の樹脂材、６は金属細線、
７は第２の樹脂材である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板と、放熱板に固定した半導体素子と、複数のリー
    ド片よりなり、それの一端が半導体素子の近傍に位置す
    るように配設すると共に、特定のリード片を放熱板にか
    しめ固定したリードと、リード片の放熱板へのかしめ部
    分を被覆した第１の樹脂材と、半導体素子の□電極とリ
    ード片とを接続した金属細線と、半導体素子、第１の樹
    脂材を含む主要部分をモールド被覆した第２の樹脂材と
    を具備したことを特徴とする半導体装置。
JP5611982U 1982-04-16 1982-04-16 半導体装置 Pending JPS58158453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5611982U JPS58158453U (ja) 1982-04-16 1982-04-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5611982U JPS58158453U (ja) 1982-04-16 1982-04-16 半導体装置

Publications (1)

Publication Number Publication Date
JPS58158453U true JPS58158453U (ja) 1983-10-22

Family

ID=30066660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5611982U Pending JPS58158453U (ja) 1982-04-16 1982-04-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS58158453U (ja)

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