JPS6112249U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6112249U
JPS6112249U JP9637584U JP9637584U JPS6112249U JP S6112249 U JPS6112249 U JP S6112249U JP 9637584 U JP9637584 U JP 9637584U JP 9637584 U JP9637584 U JP 9637584U JP S6112249 U JPS6112249 U JP S6112249U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
wire bonding
semiconductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9637584U
Other languages
English (en)
Inventor
幸孝 徳本
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP9637584U priority Critical patent/JPS6112249U/ja
Publication of JPS6112249U publication Critical patent/JPS6112249U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は本考案の一実施例を示す平面図及び
Ａ−Ａ線に沿う拡大断面図、第３図及び第４図は本考案
の他の実施例を示す平面図及びＢ一Ｂ線に沿う断面図で
ある。 第５図及び第６図は従来の半導体装置の平面図及びＣ−
Ｃ線に沿う断面図、第７図は第６図の一部拡大図である
。 ６・・・・・・半導体ペレット、８・・・・・・ボンデ
ィングパッド、１１・・・・・・リード、１１′・・・
・・・リード先端部〔被ワイヤボンデイング装置〕、１
６・・・・・・リード、１６′・・・・・・リード先端
部、〔被ワイヤボンディング位置〕、２４，２５・・・
・・・半導体ペレット、２７，２８・・・・・・ボンデ
イングパツド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 搭載半導体ペレット上の複数のボンデイングパッドと、
    この半導体ペレットに近接して配置された複数のリード
    との間をワイヤボンデイングで接続してなる半導体装置
    において、前記各リードの被ワイヤボンデイング位置を
    、前記対応するボンデイングパツドからほぼ等距離に配
    置したことを特徴とする半導体装置。
JP9637584U 1984-06-26 1984-06-26 半導体装置 Pending JPS6112249U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9637584U JPS6112249U (ja) 1984-06-26 1984-06-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9637584U JPS6112249U (ja) 1984-06-26 1984-06-26 半導体装置

Publications (1)

Publication Number Publication Date
JPS6112249U true JPS6112249U (ja) 1986-01-24

Family

ID=30655820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9637584U Pending JPS6112249U (ja) 1984-06-26 1984-06-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS6112249U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144113U (ja) * 1988-03-08 1989-10-03

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207646A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207646A (ja) * 1982-05-28 1983-12-03 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144113U (ja) * 1988-03-08 1989-10-03

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