JPS609235U - ボンデイングパツド - Google Patents

ボンデイングパツド

Info

Publication number
JPS609235U
JPS609235U JP1983100160U JP10016083U JPS609235U JP S609235 U JPS609235 U JP S609235U JP 1983100160 U JP1983100160 U JP 1983100160U JP 10016083 U JP10016083 U JP 10016083U JP S609235 U JPS609235 U JP S609235U
Authority
JP
Japan
Prior art keywords
bonding pad
pad
bonding
recorded
small area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983100160U
Other languages
English (en)
Inventor
茂 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP1983100160U priority Critical patent/JPS609235U/ja
Publication of JPS609235U publication Critical patent/JPS609235U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のホンディングパッドの構造を示す斜視図
、第２図は本考案実施例のホンディングパッドの平面図
である。 ３Ａ・・・・・・パッド、３ａ〜３ｔ・・・・・・小面
積部。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤボンディングのためのパッドが複数の小面積部に
    分割されていることを特徴とするポンディングパッド。
JP1983100160U 1983-06-30 1983-06-30 ボンデイングパツド Pending JPS609235U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983100160U JPS609235U (ja) 1983-06-30 1983-06-30 ボンデイングパツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983100160U JPS609235U (ja) 1983-06-30 1983-06-30 ボンデイングパツド

Publications (1)

Publication Number Publication Date
JPS609235U true JPS609235U (ja) 1985-01-22

Family

ID=30237065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983100160U Pending JPS609235U (ja) 1983-06-30 1983-06-30 ボンデイングパツド

Country Status (1)

Country Link
JP (1) JPS609235U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002334935A (ja) * 2001-05-08 2002-11-22 Mitsubishi Electric Corp 高周波回路チップとこのチップを有する高周波回路装置並びにその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002334935A (ja) * 2001-05-08 2002-11-22 Mitsubishi Electric Corp 高周波回路チップとこのチップを有する高周波回路装置並びにその製造方法

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