JPS5827935U - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPS5827935U JPS5827935U JP12244581U JP12244581U JPS5827935U JP S5827935 U JPS5827935 U JP S5827935U JP 12244581 U JP12244581 U JP 12244581U JP 12244581 U JP12244581 U JP 12244581U JP S5827935 U JPS5827935 U JP S5827935U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- circuit board
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の混成集積回路装置の平面図、第2図は本
考案による混成集積回路装置の一実施例を示し、同図a
は平面図、同図すは断面図、第3図は他の実施例を示す
平面図である。 6・・・・・・回路基板、7・・・・・・半導体素子、
8・・・・・・ポンディングパッド、9・・・・・・ア
ースパッド。
考案による混成集積回路装置の一実施例を示し、同図a
は平面図、同図すは断面図、第3図は他の実施例を示す
平面図である。 6・・・・・・回路基板、7・・・・・・半導体素子、
8・・・・・・ポンディングパッド、9・・・・・・ア
ースパッド。
Claims (1)
- 半導体素子がグイボンドされる回路基板を備え、回路基
板のグイボンド部分の周囲に、複数のAuからなるボン
デイングバパッドを形成し、かつグイボンド部分より小
さい面積でもってグイボンド部分にのびる、Auからな
るアースパッドを形成し、半導体素子を回路基板のグイ
ボンド部分に導電性接着剤によりグイボンドするように
したことを特徴とする混成集積回路装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12244581U JPS5827935U (ja) | 1981-08-18 | 1981-08-18 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12244581U JPS5827935U (ja) | 1981-08-18 | 1981-08-18 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5827935U true JPS5827935U (ja) | 1983-02-23 |
JPH0238446Y2 JPH0238446Y2 (ja) | 1990-10-17 |
Family
ID=29916366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12244581U Granted JPS5827935U (ja) | 1981-08-18 | 1981-08-18 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5827935U (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58127338A (ja) * | 1982-01-25 | 1983-07-29 | Sharp Corp | 電子部品の構造 |
JPS6122728U (ja) * | 1984-07-16 | 1986-02-10 | 株式会社吉野工業所 | 容器 |
US9205236B2 (en) | 2011-12-22 | 2015-12-08 | Corvia Medical, Inc. | Methods, systems, and devices for resizable intra-atrial shunts |
US9232997B2 (en) | 2006-11-07 | 2016-01-12 | Corvia Medical, Inc. | Devices and methods for retrievable intra-atrial implants |
US9277995B2 (en) | 2010-01-29 | 2016-03-08 | Corvia Medical, Inc. | Devices and methods for reducing venous pressure |
US9358371B2 (en) | 2006-11-07 | 2016-06-07 | Corvia Medical, Inc. | Intra-atrial implants made of non-braided material |
US9456812B2 (en) | 2006-11-07 | 2016-10-04 | Corvia Medical, Inc. | Devices for retrieving a prosthesis |
US10413284B2 (en) | 2006-11-07 | 2019-09-17 | Corvia Medical, Inc. | Atrial pressure regulation with control, sensing, monitoring and therapy delivery |
US10568751B2 (en) | 2006-11-07 | 2020-02-25 | Corvia Medical, Inc. | Devices and methods for coronary sinus pressure relief |
US10632292B2 (en) | 2014-07-23 | 2020-04-28 | Corvia Medical, Inc. | Devices and methods for treating heart failure |
US10675450B2 (en) | 2014-03-12 | 2020-06-09 | Corvia Medical, Inc. | Devices and methods for treating heart failure |
US11589854B2 (en) | 2011-02-10 | 2023-02-28 | Corvia Medical, Inc. | Apparatus and methods to create and maintain an intra-atrial pressure relief opening |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150251A (en) * | 1979-05-11 | 1980-11-22 | Hitachi Ltd | Semiconductor device |
JPS5797634A (en) * | 1980-12-11 | 1982-06-17 | Canon Inc | Hybrid integrated circuit |
-
1981
- 1981-08-18 JP JP12244581U patent/JPS5827935U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150251A (en) * | 1979-05-11 | 1980-11-22 | Hitachi Ltd | Semiconductor device |
JPS5797634A (en) * | 1980-12-11 | 1982-06-17 | Canon Inc | Hybrid integrated circuit |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58127338A (ja) * | 1982-01-25 | 1983-07-29 | Sharp Corp | 電子部品の構造 |
JPS6122728U (ja) * | 1984-07-16 | 1986-02-10 | 株式会社吉野工業所 | 容器 |
US10413286B2 (en) | 2006-11-07 | 2019-09-17 | Corvia Medical, Inc. | Intra-atrial implants having variable thicknesses to accommodate variable thickness in septum |
US10398421B2 (en) | 2006-11-07 | 2019-09-03 | DC Devices Pty. Ltd. | Devices and methods for the treatment of heart failure |
US10624621B2 (en) | 2006-11-07 | 2020-04-21 | Corvia Medical, Inc. | Devices and methods for the treatment of heart failure |
US9358371B2 (en) | 2006-11-07 | 2016-06-07 | Corvia Medical, Inc. | Intra-atrial implants made of non-braided material |
US9456812B2 (en) | 2006-11-07 | 2016-10-04 | Corvia Medical, Inc. | Devices for retrieving a prosthesis |
US9232997B2 (en) | 2006-11-07 | 2016-01-12 | Corvia Medical, Inc. | Devices and methods for retrievable intra-atrial implants |
US10610210B2 (en) | 2006-11-07 | 2020-04-07 | Corvia Medical, Inc. | Methods for deploying a prosthesis |
US11166705B2 (en) | 2006-11-07 | 2021-11-09 | Corvia Medical, Inc. | Intra-atrial implants made of non-braided material |
US11690609B2 (en) | 2006-11-07 | 2023-07-04 | Corvia Medical, Inc. | Devices and methods for the treatment of heart failure |
US10413284B2 (en) | 2006-11-07 | 2019-09-17 | Corvia Medical, Inc. | Atrial pressure regulation with control, sensing, monitoring and therapy delivery |
US10568751B2 (en) | 2006-11-07 | 2020-02-25 | Corvia Medical, Inc. | Devices and methods for coronary sinus pressure relief |
US9277995B2 (en) | 2010-01-29 | 2016-03-08 | Corvia Medical, Inc. | Devices and methods for reducing venous pressure |
US11589854B2 (en) | 2011-02-10 | 2023-02-28 | Corvia Medical, Inc. | Apparatus and methods to create and maintain an intra-atrial pressure relief opening |
US11759339B2 (en) | 2011-03-04 | 2023-09-19 | Corvia Medical, Inc. | Devices and methods for coronary sinus pressure relief |
US9642993B2 (en) | 2011-12-22 | 2017-05-09 | Corvia Medical, Inc. | Methods and devices for intra-atrial shunts having selectable flow rates |
US9205236B2 (en) | 2011-12-22 | 2015-12-08 | Corvia Medical, Inc. | Methods, systems, and devices for resizable intra-atrial shunts |
US10376680B2 (en) | 2011-12-22 | 2019-08-13 | Corvia Medical, Inc. | Methods, systems, and devices for resizable intra-atrial shunts |
US10675450B2 (en) | 2014-03-12 | 2020-06-09 | Corvia Medical, Inc. | Devices and methods for treating heart failure |
US10632292B2 (en) | 2014-07-23 | 2020-04-28 | Corvia Medical, Inc. | Devices and methods for treating heart failure |
Also Published As
Publication number | Publication date |
---|---|
JPH0238446Y2 (ja) | 1990-10-17 |
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