JPS59143051U - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS59143051U
JPS59143051U JP3699983U JP3699983U JPS59143051U JP S59143051 U JPS59143051 U JP S59143051U JP 3699983 U JP3699983 U JP 3699983U JP 3699983 U JP3699983 U JP 3699983U JP S59143051 U JPS59143051 U JP S59143051U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
wiring
electrode parts
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3699983U
Other languages
English (en)
Inventor
玉城　叡
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3699983U priority Critical patent/JPS59143051U/ja
Publication of JPS59143051U publication Critical patent/JPS59143051U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図および第２図、第５図はそ杆ぞれ従来例を示す平
面図および断面図、第３図、第４図および第６図はそれ
ぞれ本考案の実施例を示す断面図である。 １・・・・・・ペレット搭載ランド、２・・・・・・ス
テッチランド、３．　７．　８・・・・・・配線、５・
・・・・・半導体ペレット、４・・・・・・ボンディン
グ線、６・・・・・・チップコンデンサ、９・・・・・
・半田。

Claims (1)

    【実用新案登録請求の範囲】
  1. 接続されるべき電極部間に配線が施された集積回路装置
    において、前記配線は前記電極部の形成位置よりも下が
    った位置に形成されていることを特徴とする集積回路装
    置。
JP3699983U 1983-03-15 1983-03-15 集積回路装置 Pending JPS59143051U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3699983U JPS59143051U (ja) 1983-03-15 1983-03-15 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3699983U JPS59143051U (ja) 1983-03-15 1983-03-15 集積回路装置

Publications (1)

Publication Number Publication Date
JPS59143051U true JPS59143051U (ja) 1984-09-25

Family

ID=30167654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3699983U Pending JPS59143051U (ja) 1983-03-15 1983-03-15 集積回路装置

Country Status (1)

Country Link
JP (1) JPS59143051U (ja)

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