JPH0392038U - - Google Patents

Info

Publication number
JPH0392038U
JPH0392038U JP1989151701U JP15170189U JPH0392038U JP H0392038 U JPH0392038 U JP H0392038U JP 1989151701 U JP1989151701 U JP 1989151701U JP 15170189 U JP15170189 U JP 15170189U JP H0392038 U JPH0392038 U JP H0392038U
Authority
JP
Japan
Prior art keywords
chip
resin substrate
finger leads
holes
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989151701U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989151701U priority Critical patent/JPH0392038U/ja
Publication of JPH0392038U publication Critical patent/JPH0392038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の一実施例である、ＩＣチツ
プの電極と樹脂基板のフインガリードがボンデイ
ングされ且つＩＣチツプのボンデイング面が絶縁
樹脂層で保護された状態を示す拡大断面図であり
、第２図は、第１図の接続状態前のＩＣチツプと
樹脂基板の拡大断面図であり、第３図は樹脂基板
とＩＣチツプの接続前の他の実施例を示す拡大断
面図である。 １……樹脂基板、１ａ……絶縁樹脂層、２……
ＩＣチツプ、３……フインガリード、４，６……
バンプ電極、５……熱圧着治具、７……スルーホ
ール、８……接続部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂基板の一面側に複数のフインガリードを設
    け、該樹脂基板の他面側から前記各フインガリー
    ドの接続部を他面側に表出するスルーホールを形
    成し、該スルーホールのそれぞれにバンプ電極を
    挿入し、このバンプ電極を介してＩＣチツプの電
    極を対応する前記各フインガリードにボンデイン
    グし、このＩＣチツプのボンデイング面側を保護
    用の絶縁樹脂層で覆つたＩＣチツプの取付構造で
    あつて、前記絶縁樹脂層を、前記樹脂基板のＩＣ
    チツプとの対向部分を溶融硬化して形成したこと
    を特徴とするＩＣチツプの接続構造。
JP1989151701U 1989-12-29 1989-12-29 Pending JPH0392038U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989151701U JPH0392038U (ja) 1989-12-29 1989-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989151701U JPH0392038U (ja) 1989-12-29 1989-12-29

Publications (1)

Publication Number Publication Date
JPH0392038U true JPH0392038U (ja) 1991-09-19

Family

ID=31697988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989151701U Pending JPH0392038U (ja) 1989-12-29 1989-12-29

Country Status (1)

Country Link
JP (1) JPH0392038U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002045151A1 (fr) * 2000-12-01 2002-06-06 Kanebo, Limited Boitier semi-conducteur et procede de fabrication

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002045151A1 (fr) * 2000-12-01 2002-06-06 Kanebo, Limited Boitier semi-conducteur et procede de fabrication

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPH0392038U (ja)
JP2743157B2 (ja) 樹脂封止型半導体装置
JPH0310670Y2 (ja)
JPH0270447U (ja)
JPS6413144U (ja)
JPS6232550U (ja)
JPH0388350U (ja)
JPS6153934U (ja)
JPS5850947U (ja) 熱記録ヘツド
JPS5933245U (ja) 半導体装置
JPH01125544U (ja)
JPH0334240U (ja)
JPH02146437U (ja)
JPH0291345U (ja)
JPS6219751U (ja)
JPH0165148U (ja)
JPH0173936U (ja)
JPS61111154U (ja)
JPS5842940U (ja) 混成集積回路装置
JPS5881940U (ja) 半導体素子の取付構造
JPS6081652U (ja) 樹脂封止型半導体装置
JPS5958941U (ja) 半導体装置
JPS63157934U (ja)
JPS63167734U (ja)