JPH0165148U - - Google Patents

Info

Publication number
JPH0165148U
JPH0165148U JP16013387U JP16013387U JPH0165148U JP H0165148 U JPH0165148 U JP H0165148U JP 16013387 U JP16013387 U JP 16013387U JP 16013387 U JP16013387 U JP 16013387U JP H0165148 U JPH0165148 U JP H0165148U
Authority
JP
Japan
Prior art keywords
lower layer
bonding pad
layer
insulating film
interlayer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16013387U
Other languages
English (en)
Other versions
JPH0642340Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987160133U priority Critical patent/JPH0642340Y2/ja
Publication of JPH0165148U publication Critical patent/JPH0165148U/ja
Application granted granted Critical
Publication of JPH0642340Y2 publication Critical patent/JPH0642340Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図及び第２図は夫々本考案を説明する為の
断面図及び平面図、第３図は本考案の第２の実施
例を説明する為の平面図、第４図は従来例を説明
する為の断面図である。 １１は半導体基板、１３は下層のボンデイング
パツド、１４は下層の延在部、１６は上層のボン
デイングパツド、２１は上層のボンデイングパツ
ド１６の側端部である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 下層のボンデイングパツドと、この下層のボン
    デイングパツドから延在し前記下層のボンデイン
    グパツドと同層又はそれより上層の配線層と接続
    する下層の延在部と、前記下層のボンデイングパ
    ツド及び下層の延在部を覆うポリイミド系の層間
    絶縁膜と、該層間絶縁膜のスルーホールを介して
    前記下層のボンデイングパツドと接続しその側端
    部が前記下層のボンデイングパツドによる段差を
    覆うように前記層間絶縁膜上を延在する上層のボ
    ンデイングパツドとを具備することを特徴とする
    半導体装置。
JP1987160133U 1987-10-20 1987-10-20 半導体装置 Expired - Lifetime JPH0642340Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160133U JPH0642340Y2 (ja) 1987-10-20 1987-10-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987160133U JPH0642340Y2 (ja) 1987-10-20 1987-10-20 半導体装置

Publications (2)

Publication Number Publication Date
JPH0165148U true JPH0165148U (ja) 1989-04-26
JPH0642340Y2 JPH0642340Y2 (ja) 1994-11-02

Family

ID=31441933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160133U Expired - Lifetime JPH0642340Y2 (ja) 1987-10-20 1987-10-20 半導体装置

Country Status (1)

Country Link
JP (1) JPH0642340Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4740536B2 (ja) * 2003-11-26 2011-08-03 ローム株式会社 半導体装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996851U (ja) * 1982-12-20 1984-06-30 日本電気株式会社 半導体装置
JPS6074658A (ja) * 1983-09-30 1985-04-26 Toshiba Corp 半導体集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5996851U (ja) * 1982-12-20 1984-06-30 日本電気株式会社 半導体装置
JPS6074658A (ja) * 1983-09-30 1985-04-26 Toshiba Corp 半導体集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4740536B2 (ja) * 2003-11-26 2011-08-03 ローム株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPH0642340Y2 (ja) 1994-11-02

Similar Documents

Publication Publication Date Title
JPH0279044U (ja)
JPH0165148U (ja)
JPH01176936U (ja)
JPS6153934U (ja)
JPS6338328U (ja)
JPS6245837U (ja)
JPS6371538U (ja)
JPS62116563U (ja)
JPH0183340U (ja)
JPS62122359U (ja)
JPS6232550U (ja)
JPH0217839U (ja)
JPH024281U (ja)
JPS62192642U (ja)
JPH0262734U (ja)
JPS63191637U (ja)
JPH0247034U (ja)
JPS61196277U (ja)
JPS61192447U (ja)
JPS6310571U (ja)
JPH03120052U (ja)
JPH0233439U (ja)
JPS62114447U (ja)
JPS6413144U (ja)
JPS62134240U (ja)