JPS587355U - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS587355U
JPS587355U JP1981100456U JP10045681U JPS587355U JP S587355 U JPS587355 U JP S587355U JP 1981100456 U JP1981100456 U JP 1981100456U JP 10045681 U JP10045681 U JP 10045681U JP S587355 U JPS587355 U JP S587355U
Authority
JP
Japan
Prior art keywords
lead
lead frame
frame
gou
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981100456U
Other languages
English (en)
Inventor
池永　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1981100456U priority Critical patent/JPS587355U/ja
Publication of JPS587355U publication Critical patent/JPS587355U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のリードフレームの例を示す平面図、第２
図及び第３図はファインリード部の曲がり状態を示す要
部の平面図及びその側面図、第４図はワイヤーボンド状
態の説明図、第５図及び第　　　′６図は夫タワイヤー
リードをボンディングした状態の例を示す側面図、第７
図は本考案のリードフレームの例を示す平面図、第８図
はファインリード部とグイパッド部の分断状態を示す要
部の平面図である。 １は枠型連結部、２はリード部、２ａはファインリード
部、３はグイパッド部である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 枠状連結部より中央に向って延長する複数のリード部と
    半導体ペレットを取付けるグイパッド部を有し、該複数
    のリード部の各先端のファインリード部が上記グイパッ
    ド部に連結されて成り、上記ダイパ゛シト部上への半導
    体ペレットの取付工程の前後で上記グイパッド部と各フ
    ァインリード部が分離されるようにして成るリードフレ
    ーム。
JP1981100456U 1981-07-06 1981-07-06 リ−ドフレ−ム Pending JPS587355U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981100456U JPS587355U (ja) 1981-07-06 1981-07-06 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981100456U JPS587355U (ja) 1981-07-06 1981-07-06 リ−ドフレ−ム

Publications (1)

Publication Number Publication Date
JPS587355U true JPS587355U (ja) 1983-01-18

Family

ID=29895143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981100456U Pending JPS587355U (ja) 1981-07-06 1981-07-06 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS587355U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286055U (ja) * 1988-12-21 1990-07-06
CN102574468A (zh) * 2009-10-16 2012-07-11 本田技研工业株式会社 车辆用仪表板构造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286055U (ja) * 1988-12-21 1990-07-06
CN102574468A (zh) * 2009-10-16 2012-07-11 本田技研工业株式会社 车辆用仪表板构造

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