JPS5818353U - 電子部品 - Google Patents

電子部品

Info

Publication number
JPS5818353U
JPS5818353U JP11316081U JP11316081U JPS5818353U JP S5818353 U JPS5818353 U JP S5818353U JP 11316081 U JP11316081 U JP 11316081U JP 11316081 U JP11316081 U JP 11316081U JP S5818353 U JPS5818353 U JP S5818353U
Authority
JP
Japan
Prior art keywords
electronic components
electronic component
lead
view
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11316081U
Other languages
English (en)
Inventor
井上　和洋
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP11316081U priority Critical patent/JPS5818353U/ja
Publication of JPS5818353U publication Critical patent/JPS5818353U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は電子部品の一例を示す半導体装置の部分平面図
、第２図は第１図Ａ−Ａ断面図、第３図は本考案による
電子部品に用いるリードフレームの一例を示す平面図、
第４図は第３薗リードフレームを用いた電子部品半製品
を示す平面図、第５図は第４図電子部品の分割例を示す
平面図、第６図は本考案による電子部品の斜視図、第７
図は本考案の他の実施例を示す斜視図、第８図乃至第１
０図は端子リードの成形例を示す斜視図である。 ５−−−−−・部品本体、３ａ’　、　　３ｂ、　　３
ｃ、　　３ａ’　。 ３ｂ’　、　　３ｃ’−−−−−−リード、３ｄ、　　
３ｅ、　　３ｆ−−−−−一端子リード、９・・・・・
・連結部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外装部よりリードを導出したものにおいて、上記リード
    の導出方向に隣接する位置に端子リードを連結部を介し
    て一体に連結したことを特徴とする電子部品。
JP11316081U 1981-07-29 1981-07-29 電子部品 Pending JPS5818353U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11316081U JPS5818353U (ja) 1981-07-29 1981-07-29 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11316081U JPS5818353U (ja) 1981-07-29 1981-07-29 電子部品

Publications (1)

Publication Number Publication Date
JPS5818353U true JPS5818353U (ja) 1983-02-04

Family

ID=29907468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11316081U Pending JPS5818353U (ja) 1981-07-29 1981-07-29 電子部品

Country Status (1)

Country Link
JP (1) JPS5818353U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035564A (ja) * 2013-08-09 2015-02-19 新電元工業株式会社 半導体装置及びリードフレーム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015035564A (ja) * 2013-08-09 2015-02-19 新電元工業株式会社 半導体装置及びリードフレーム

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