JPS58429U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58429U
JPS58429U JP9395881U JP9395881U JPS58429U JP S58429 U JPS58429 U JP S58429U JP 9395881 U JP9395881 U JP 9395881U JP 9395881 U JP9395881 U JP 9395881U JP S58429 U JPS58429 U JP S58429U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
tin
alloy
ground chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9395881U
Other languages
English (en)
Other versions
JPS638136Y2 (ja
Inventor
田中　俊範
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP9395881U priority Critical patent/JPS58429U/ja
Publication of JPS58429U publication Critical patent/JPS58429U/ja
Application granted granted Critical
Publication of JPS638136Y2 publication Critical patent/JPS638136Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の実施例に用いるグランドチップを示す
断面図である。第２図ａはサーディツプパッケージにグ
ランドチップを用いた本考案実施例の封止前の上から見
た図で、第２図すは第２図ａの断面図である。 尚、図において、１・・・・・・ワイヤーボンディング
金属、２・・・・・・中間金属、３・・・・・・グイボ
ンディング金属、４・・・・・・グランドチップ、５・
・・・・・ＩＣチップ、６・・・・・・リードフレニム
、７・・・・・・Ａ１．８・・・・・・低融点°　　ガ
ラス、９・・・・・・Ａｌ／Ｓｉ線、１０・・・・・・
Ａｕペースト、（１１・・・・・・セラミックスである
。

Claims (1)

    【実用新案登録請求の範囲】
  1. アルミニウムーシリコン合金と、中間金属と、スズもし
    くはスズ合金からなるグランドチップを有することを特
    徴とする半導体装置。
JP9395881U 1981-06-25 1981-06-25 半導体装置 Granted JPS58429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9395881U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9395881U JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Publications (2)

Publication Number Publication Date
JPS58429U true JPS58429U (ja) 1983-01-05
JPS638136Y2 JPS638136Y2 (ja) 1988-03-10

Family

ID=29888914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9395881U Granted JPS58429U (ja) 1981-06-25 1981-06-25 半導体装置

Country Status (1)

Country Link
JP (1) JPS58429U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167449A (ja) * 1984-02-10 1985-08-30 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS638136Y2 (ja) 1988-03-10

Similar Documents

Publication Publication Date Title
JPS58429U (ja) 半導体装置
JPS58106947U (ja) 半導体の実装構造
JPS59145047U (ja) 半導体装置
JPS5881942U (ja) 半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS5883157U (ja) 樹脂封止半導体装置
JPS60190052U (ja) 半導体装置
JPS59132642U (ja) 樹脂封止型半導体装置
JPS6042744U (ja) 半導体装置
JPS5996849U (ja) 半導体装置
JPS588952U (ja) 半導体装置
JPS60106342U (ja) 半導体装置用セラミツクパツケ−ジキヤツプ
JPS58140645U (ja) Ｉｃリ−ドフレ−ム
JPS5877061U (ja) 半導体装置
JPS6142843U (ja) 半導体装置
JPS602849U (ja) 集積回路装置
JPS59192854U (ja) 光半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS58177947U (ja) 半導体装置
JPS58111943U (ja) 樹脂封止型半導体装置
JPS5999447U (ja) 半導体用パツケ−ジ
JPS60141148U (ja) 半導体装置
JPS58155852U (ja) 半導体装置
JPS58184840U (ja) 半導体装置
JPS58140636U (ja) 半導体装置