JPS59140437U - 半導体素子接着用半田 - Google Patents

半導体素子接着用半田

Info

Publication number
JPS59140437U
JPS59140437U JP3437683U JP3437683U JPS59140437U JP S59140437 U JPS59140437 U JP S59140437U JP 3437683 U JP3437683 U JP 3437683U JP 3437683 U JP3437683 U JP 3437683U JP S59140437 U JPS59140437 U JP S59140437U
Authority
JP
Japan
Prior art keywords
solder
bonding semiconductor
semiconductor elements
alloy component
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3437683U
Other languages
English (en)
Inventor
誠 伊藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3437683U priority Critical patent/JPS59140437U/ja
Publication of JPS59140437U publication Critical patent/JPS59140437U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係る半田片の断面を含む斜
視図、第２図は第１図の半田を用いて半導体チップを搭
載基板に接着した状態の断面図である。 １・・・・・・ニッケル粒を含む半田、２・・・・・・
半田合金成分、３・・・・・・ニッケル粒、４・・・・
・・半導体素子、５・・・・・・搭載基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 合金成分中にこの合金成分と違う溶解度の低い高融点金
    属粒を含有せしめたことを特徴とする半導体素子接着用
    半田。
JP3437683U 1983-03-10 1983-03-10 半導体素子接着用半田 Pending JPS59140437U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3437683U JPS59140437U (ja) 1983-03-10 1983-03-10 半導体素子接着用半田

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3437683U JPS59140437U (ja) 1983-03-10 1983-03-10 半導体素子接着用半田

Publications (1)

Publication Number Publication Date
JPS59140437U true JPS59140437U (ja) 1984-09-19

Family

ID=30165142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3437683U Pending JPS59140437U (ja) 1983-03-10 1983-03-10 半導体素子接着用半田

Country Status (1)

Country Link
JP (1) JPS59140437U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252030A (ja) * 2004-03-04 2005-09-15 Hitachi Metals Ltd 鉛フリー半田材料および半田材料の製造方法
WO2005120765A1 (ja) * 2004-06-08 2005-12-22 Senju Metal Industry Co., Ltd 高融点金属粒分散フォームソルダの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252030A (ja) * 2004-03-04 2005-09-15 Hitachi Metals Ltd 鉛フリー半田材料および半田材料の製造方法
JP4639607B2 (ja) * 2004-03-04 2011-02-23 日立金属株式会社 鉛フリー半田材料およびＰｂフリー半田材料の製造方法
WO2005120765A1 (ja) * 2004-06-08 2005-12-22 Senju Metal Industry Co., Ltd 高融点金属粒分散フォームソルダの製造方法
KR100937622B1 (ko) * 2004-06-08 2010-01-20 센주긴조쿠고교 가부시키가이샤 고융점 금속 입자 분산 폼 솔더의 제조 방법, 폼 솔더, 혼합 모합금 및 성형재

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