JPS6042741U - 電子部品の実装構造 - Google Patents

電子部品の実装構造

Info

Publication number
JPS6042741U
JPS6042741U JP13607283U JP13607283U JPS6042741U JP S6042741 U JPS6042741 U JP S6042741U JP 13607283 U JP13607283 U JP 13607283U JP 13607283 U JP13607283 U JP 13607283U JP S6042741 U JPS6042741 U JP S6042741U
Authority
JP
Japan
Prior art keywords
electric circuit
mounting structure
circuit board
electronic component
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13607283U
Other languages
English (en)
Inventor
茂成 高見
達彦 入江
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP13607283U priority Critical patent/JPS6042741U/ja
Publication of JPS6042741U publication Critical patent/JPS6042741U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図はこの考案の一実施例を示す図で、第
１図は断面図、第２図は斜視図、第３図は従来例を示す
断面図である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属ベースの電気回路基板の中央部にＩＣチップを塔載
    するパッドを形成すると共にこのパッドより周縁に至る
    電気回路を形成し、他方、表裏面に対応するパッドを形
    成すると共にこの対応するパッドをスルホールで接続し
    た提を形成し、この提を電気回路基板の周囲に配し対応
    するパッドを介して電気回路基板の電気回路と母電気回
    路基板の電気回路を接続して成ることを特徴とする電子
    部品の実装構造。
JP13607283U 1983-08-31 1983-08-31 電子部品の実装構造 Pending JPS6042741U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13607283U JPS6042741U (ja) 1983-08-31 1983-08-31 電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13607283U JPS6042741U (ja) 1983-08-31 1983-08-31 電子部品の実装構造

Publications (1)

Publication Number Publication Date
JPS6042741U true JPS6042741U (ja) 1985-03-26

Family

ID=30306061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13607283U Pending JPS6042741U (ja) 1983-08-31 1983-08-31 電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS6042741U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4847774A (ja) * 1971-10-18 1973-07-06
JPS5356493A (en) * 1976-10-29 1978-05-22 Hitachi Ltd System for producting reactor fuel replacement plan
JPS53131634A (en) * 1977-04-20 1978-11-16 Yoshitake Yamamoto Apparatus for holding rider*s shoe firmly in pedal of bicycle and frame for the bicycle
JPS5856447A (ja) * 1981-09-11 1983-04-04 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 識別カ−ドおよびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4847774A (ja) * 1971-10-18 1973-07-06
JPS5356493A (en) * 1976-10-29 1978-05-22 Hitachi Ltd System for producting reactor fuel replacement plan
JPS53131634A (en) * 1977-04-20 1978-11-16 Yoshitake Yamamoto Apparatus for holding rider*s shoe firmly in pedal of bicycle and frame for the bicycle
JPS5856447A (ja) * 1981-09-11 1983-04-04 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 識別カ−ドおよびその製造方法

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