JPS6027433U - 電子部品の実装構造 - Google Patents

電子部品の実装構造

Info

Publication number
JPS6027433U
JPS6027433U JP11887483U JP11887483U JPS6027433U JP S6027433 U JPS6027433 U JP S6027433U JP 11887483 U JP11887483 U JP 11887483U JP 11887483 U JP11887483 U JP 11887483U JP S6027433 U JPS6027433 U JP S6027433U
Authority
JP
Japan
Prior art keywords
mounting structure
electronic component
component mounting
chip
mounting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11887483U
Other languages
English (en)
Inventor
茂成 高見
達彦 入江
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP11887483U priority Critical patent/JPS6027433U/ja
Publication of JPS6027433U publication Critical patent/JPS6027433U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図はこの考案の一実施例を示す図で、第
１図は断面図、第２図は斜視図、第３図はこの考案の異
な不実施例を示す斜視図、第４図は従来例を示す側面図
である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属ベースの電気回路に凹部を設けてＩＣチップの実装
    部分とすると共に実装部分の外に導出した部分をパッド
    としてチップキャリアを形成し、このチップキャリアの
    実装部分にＩＣチップを実装すると共に樹脂封止し、こ
    のパッドを母電気回路に対向接続して成ることを特徴と
    する電子部品の実装構造。
JP11887483U 1983-07-29 1983-07-29 電子部品の実装構造 Pending JPS6027433U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11887483U JPS6027433U (ja) 1983-07-29 1983-07-29 電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11887483U JPS6027433U (ja) 1983-07-29 1983-07-29 電子部品の実装構造

Publications (1)

Publication Number Publication Date
JPS6027433U true JPS6027433U (ja) 1985-02-25

Family

ID=30273052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11887483U Pending JPS6027433U (ja) 1983-07-29 1983-07-29 電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS6027433U (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498168A (ja) * 1972-05-10 1974-01-24
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
JPS54128277A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Semiconductor device
JPS5567154A (en) * 1978-11-15 1980-05-21 Matsushita Electric Ind Co Ltd Method of installing lead-less ic package
JPS55123151A (en) * 1979-03-15 1980-09-22 Nec Corp Integrated circuit device
JPS5745262A (en) * 1980-09-01 1982-03-15 Fujitsu Ltd Sealing and fitting structure of semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498168A (ja) * 1972-05-10 1974-01-24
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
JPS54128277A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Semiconductor device
JPS5567154A (en) * 1978-11-15 1980-05-21 Matsushita Electric Ind Co Ltd Method of installing lead-less ic package
JPS55123151A (en) * 1979-03-15 1980-09-22 Nec Corp Integrated circuit device
JPS5745262A (en) * 1980-09-01 1982-03-15 Fujitsu Ltd Sealing and fitting structure of semiconductor device

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