JPS59164241U - セラミツクパツケ−ジ - Google Patents
セラミツクパツケ−ジInfo
- Publication number
- JPS59164241U JPS59164241U JP1983057528U JP5752883U JPS59164241U JP S59164241 U JPS59164241 U JP S59164241U JP 1983057528 U JP1983057528 U JP 1983057528U JP 5752883 U JP5752883 U JP 5752883U JP S59164241 U JPS59164241 U JP S59164241U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic package
- package
- ceramic
- package body
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来のセラミックパッケージを示す断面図、第
2図は本考案によるセラミックパッケージの第1の実施
例を示す断面図、第3図は第2の実施例を示す断面図で
ある。 4・・・半導体素子、5・・・シリコン樹脂またはエポ
キシ樹脂、6・・・パッケージ本体、7・・・接i面、
8・・・ひさし部、9・・・リード端子、10・・・ひ
さし部、11・・・パッケージ本体、12・・・金属リ
ング、13・・・接着面、14・・・リード端子。
2図は本考案によるセラミックパッケージの第1の実施
例を示す断面図、第3図は第2の実施例を示す断面図で
ある。 4・・・半導体素子、5・・・シリコン樹脂またはエポ
キシ樹脂、6・・・パッケージ本体、7・・・接i面、
8・・・ひさし部、9・・・リード端子、10・・・ひ
さし部、11・・・パッケージ本体、12・・・金属リ
ング、13・・・接着面、14・・・リード端子。
Claims (1)
- 内部に半導体素子を実装するパッケージ本体と、このパ
ッケージ本体上部の接着面に接着される蓋とを有するセ
ラミックパッケージにおいて、パッケージ本体の内周面
側にセラミックまたは金属材料によりひさし部を設けた
ことを特徴とするセラミックパッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983057528U JPS59164241U (ja) | 1983-04-19 | 1983-04-19 | セラミツクパツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983057528U JPS59164241U (ja) | 1983-04-19 | 1983-04-19 | セラミツクパツケ−ジ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59164241U true JPS59164241U (ja) | 1984-11-02 |
Family
ID=30187829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983057528U Pending JPS59164241U (ja) | 1983-04-19 | 1983-04-19 | セラミツクパツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59164241U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172176U (ja) * | 1986-04-15 | 1987-10-31 | ||
JP2018206825A (ja) * | 2017-05-31 | 2018-12-27 | 新電元工業株式会社 | 電子モジュール |
-
1983
- 1983-04-19 JP JP1983057528U patent/JPS59164241U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172176U (ja) * | 1986-04-15 | 1987-10-31 | ||
JP2018206825A (ja) * | 2017-05-31 | 2018-12-27 | 新電元工業株式会社 | 電子モジュール |
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