JPS63108641U - - Google Patents

Info

Publication number
JPS63108641U
JPS63108641U JP1986203810U JP20381086U JPS63108641U JP S63108641 U JPS63108641 U JP S63108641U JP 1986203810 U JP1986203810 U JP 1986203810U JP 20381086 U JP20381086 U JP 20381086U JP S63108641 U JPS63108641 U JP S63108641U
Authority
JP
Japan
Prior art keywords
chip
protective film
internal protective
ball portion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986203810U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986203810U priority Critical patent/JPS63108641U/ja
Publication of JPS63108641U publication Critical patent/JPS63108641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体装置の一例の概略断面
図、第２図は従来の半導体装置の一例の概略断面
図である。 １…内部保護膜、２…チツプ、３…樹脂パツケ
ージ、４…外部端子、５…ボール部、６…ネツク
部、７…ワイヤ部、ｔ…内部保護膜の膜厚、ｈ…
ボール部の高さ。

Claims (1)

  1. 【実用新案登録請求の範囲】 表面に集積回路が形成されるチツプと、そのチ
    ツプを封止する樹脂パツケージと、そのチツプの
    表面にボンデイングされる外部端子と接続するた
    めのボール部を具備し、そのチツプの表面には内
    部保護膜が形成されるものにおいて、 上記内部保護膜は、ボンデイングの上記ボール
    部の高さ以内の厚みを有することを特徴とする半
    導体装置。
JP1986203810U 1986-12-27 1986-12-27 Pending JPS63108641U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986203810U JPS63108641U (ja) 1986-12-27 1986-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986203810U JPS63108641U (ja) 1986-12-27 1986-12-27

Publications (1)

Publication Number Publication Date
JPS63108641U true JPS63108641U (ja) 1988-07-13

Family

ID=31169489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986203810U Pending JPS63108641U (ja) 1986-12-27 1986-12-27

Country Status (1)

Country Link
JP (1) JPS63108641U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55166942A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Semiconductor device
JPS59172757A (ja) * 1983-03-22 1984-09-29 Matsushita Electronics Corp 半導体装置
JPS6148266A (ja) * 1984-08-15 1986-03-08 Fujitsu Ltd 時分割多重回線折返試験方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55166942A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Semiconductor device
JPS59172757A (ja) * 1983-03-22 1984-09-29 Matsushita Electronics Corp 半導体装置
JPS6148266A (ja) * 1984-08-15 1986-03-08 Fujitsu Ltd 時分割多重回線折返試験方法

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