JPH0245676U - - Google Patents

Info

Publication number
JPH0245676U
JPH0245676U JP1988124831U JP12483188U JPH0245676U JP H0245676 U JPH0245676 U JP H0245676U JP 1988124831 U JP1988124831 U JP 1988124831U JP 12483188 U JP12483188 U JP 12483188U JP H0245676 U JPH0245676 U JP H0245676U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
electronic components
circuit board
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988124831U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988124831U priority Critical patent/JPH0245676U/ja
Publication of JPH0245676U publication Critical patent/JPH0245676U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す混成集積回路
装置の断面図、第２図は従来の混成集積回路装置
の断面図である。 １１……混成集積回路基板、１２……Ａｇペー
スト、１３……セラミツク・チツプ・コンデンサ
、１４……半導体チツプ、１５……ボンデイング
・ワイヤー、１６……シリコン樹脂、１７……ミ
ニモールド・トランジスタ、１８……リード端子
、１９……エポキシ外装樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 混成集積回路基板と、前記基板上に搭載される
    半導体チツプおよびセラミツク・チツプ・コンデ
    ンサ等の電子部品とを含み、前記セラミツク・チ
    ツプ・コンデンサ等の電子部品が前記半導体チツ
    プを混成集積回路基板に回路接続するワイヤーの
    下に搭載されることを特徴とする混成集積回路装
    置。
JP1988124831U 1988-09-22 1988-09-22 Pending JPH0245676U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988124831U JPH0245676U (ja) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988124831U JPH0245676U (ja) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245676U true JPH0245676U (ja) 1990-03-29

Family

ID=31374904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988124831U Pending JPH0245676U (ja) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245676U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP4618941B2 (ja) * 2001-07-24 2011-01-26 三洋電機株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JPS5827934U (ja) 半導体装置
JPH0245676U (ja)
JPS6027441U (ja) 混成集積回路装置
JPS63187330U (ja)
JPH0247080U (ja)
JPS6448051U (ja)
JPH01163334U (ja)
JPS63115233U (ja)
JPH0474458U (ja)
JPS646038U (ja)
JPS64332U (ja)
JPS6169850U (ja)
JPS6316455U (ja)
JPH03116032U (ja)
JPS6284970U (ja)
JPS63113979U (ja)
JPS6232556U (ja)
JPS63128745U (ja)
JPS58195445U (ja) 半導体集積回路パツケ−ジ
JPS6120058U (ja) 樹脂封止型半導体装置
JPS63132477U (ja)
JPS5856446U (ja) 樹脂封止半導体装置
JPS62112160U (ja)
JPH01135736U (ja)
JPS63108641U (ja)