JPS6232556U - - Google Patents

Info

Publication number
JPS6232556U
JPS6232556U JP12372285U JP12372285U JPS6232556U JP S6232556 U JPS6232556 U JP S6232556U JP 12372285 U JP12372285 U JP 12372285U JP 12372285 U JP12372285 U JP 12372285U JP S6232556 U JPS6232556 U JP S6232556U
Authority
JP
Japan
Prior art keywords
substrate
package
optical
optical element
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12372285U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12372285U priority Critical patent/JPS6232556U/ja
Publication of JPS6232556U publication Critical patent/JPS6232556U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す縦断面図、第
２図は第１図のＡ―Ａ′線断面図、第３図及び第
４図は光素子を備えた半導体装置の従来例を示す
縦断面図である。 １……パツケージ、２……ステム、４……パツ
ケージ端子、７……基板、８……ＩＣチツプ、９
……半田バンプ、１０……光素子、１１……ダイ
ボンド、１２，１３……リードワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体装置のパツケージを構成するステム上に
    ＩＣ用の基板を設け、該基板に光素子駆動用、光
    信号処理用等のＩＣチツプをフイリツプチツプ法
    により搭載すると共に、該ＩＣチツプに発光用或
    は受光用の光素子をダイボンドにより搭載して、
    前記パツケージの内部に前記基板と前記ＩＣチツ
    プと前記光素子とを積層化した状態で実装し、且
    つ前記光素子とを前記基板並びに前記基板とパツ
    ケージ端子とをリードワイヤを介して電気的に接
    続してなることを特徴とする光素子を備えた半導
    体装置。
JP12372285U 1985-08-12 1985-08-12 Pending JPS6232556U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12372285U JPS6232556U (ja) 1985-08-12 1985-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12372285U JPS6232556U (ja) 1985-08-12 1985-08-12

Publications (1)

Publication Number Publication Date
JPS6232556U true JPS6232556U (ja) 1987-02-26

Family

ID=31015081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12372285U Pending JPS6232556U (ja) 1985-08-12 1985-08-12

Country Status (1)

Country Link
JP (1) JPS6232556U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289172A (ja) * 1988-05-16 1989-11-21 Sumitomo Electric Ind Ltd 光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289172A (ja) * 1988-05-16 1989-11-21 Sumitomo Electric Ind Ltd 光半導体装置

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