JPS62112160U - - Google Patents

Info

Publication number
JPS62112160U
JPS62112160U JP1985199839U JP19983985U JPS62112160U JP S62112160 U JPS62112160 U JP S62112160U JP 1985199839 U JP1985199839 U JP 1985199839U JP 19983985 U JP19983985 U JP 19983985U JP S62112160 U JPS62112160 U JP S62112160U
Authority
JP
Japan
Prior art keywords
substrate
discrete components
package
chip
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985199839U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985199839U priority Critical patent/JPS62112160U/ja
Publication of JPS62112160U publication Critical patent/JPS62112160U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図及び第２図は本考案の実施例を示す図で
、第１図はハイブリツドＩＣの断面図、第２図は
その要部を示す図である。第３図及び第４図は従
来例を示す図で、第３図はハイブリツドＩＣの断
面図、第４図はその要部を示す図である。 第１図及び第２図において、１はパツケージ、
２はパツケージの基体（多層プリント板）、３は
パツケージの側壁、４はパツケージのキヤツプ、
５はＩＣチツプ、５ａはボンデイングワイヤ、６
はデイスクリート部品、８は外部リード、１０は
Ａｕ合金バンプである。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上にＩＣチツプ及びデイスクリート部品を
    実装してなる半導体装置において、 前記デイスクリート部品をＡｕ合金を用いて基
    板に接合固定したことを特徴とする半導体装置。
JP1985199839U 1985-12-28 1985-12-28 Pending JPS62112160U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985199839U JPS62112160U (ja) 1985-12-28 1985-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985199839U JPS62112160U (ja) 1985-12-28 1985-12-28

Publications (1)

Publication Number Publication Date
JPS62112160U true JPS62112160U (ja) 1987-07-17

Family

ID=31161835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985199839U Pending JPS62112160U (ja) 1985-12-28 1985-12-28

Country Status (1)

Country Link
JP (1) JPS62112160U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4991937A (ja) * 1972-12-27 1974-09-03
JPS567347B2 (ja) * 1973-09-28 1981-02-17
JPS59124760A (ja) * 1983-01-04 1984-07-18 Nec Corp 読み出し専用メモリ
JPS59188996A (ja) * 1983-04-12 1984-10-26 松下電子工業株式会社 電子部品の実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4991937A (ja) * 1972-12-27 1974-09-03
JPS567347B2 (ja) * 1973-09-28 1981-02-17
JPS59124760A (ja) * 1983-01-04 1984-07-18 Nec Corp 読み出し専用メモリ
JPS59188996A (ja) * 1983-04-12 1984-10-26 松下電子工業株式会社 電子部品の実装方法

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