JPS593547U - 電子部品の封止構造 - Google Patents

電子部品の封止構造

Info

Publication number
JPS593547U
JPS593547U JP1982097380U JP9738082U JPS593547U JP S593547 U JPS593547 U JP S593547U JP 1982097380 U JP1982097380 U JP 1982097380U JP 9738082 U JP9738082 U JP 9738082U JP S593547 U JPS593547 U JP S593547U
Authority
JP
Japan
Prior art keywords
sealing structure
electronic components
adhesive
cap
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982097380U
Other languages
English (en)
Inventor
薗田　英明
岡田　忠暁
健之 鈴木
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1982097380U priority Critical patent/JPS593547U/ja
Publication of JPS593547U publication Critical patent/JPS593547U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、　　ｂは本考案を適用する全体構造を説明す
る部分断面上面図と正面図、第２図は従来の部分的斜視
図、第３図ａ、　　ｂは従来の接着剤塗布方法を示す部
分図、第４図ａ、　　ｂは本考案の接着剤塗布方法を示
す部分図、第５図は本考案の部分的斜視図である。 １・・・チップキャリアベース、２・・・半導体チップ
、３・・・ボンディングワイヤ、４・・・封止キャップ
、５・・・接着剤、６・・・多層接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体部品をボンディング王たベース基板と、接着剤を
    塗布したキャップとより成るパッケージにおいて、前記
    キャップのコーナ部に特に厚く接着剤を塗布して構成し
    たことを特徴とする電子部品の封止構造。
JP1982097380U 1982-06-30 1982-06-30 電子部品の封止構造 Pending JPS593547U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982097380U JPS593547U (ja) 1982-06-30 1982-06-30 電子部品の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982097380U JPS593547U (ja) 1982-06-30 1982-06-30 電子部品の封止構造

Publications (1)

Publication Number Publication Date
JPS593547U true JPS593547U (ja) 1984-01-11

Family

ID=30231660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982097380U Pending JPS593547U (ja) 1982-06-30 1982-06-30 電子部品の封止構造

Country Status (1)

Country Link
JP (1) JPS593547U (ja)

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