JPS6448051U - - Google Patents
Info
- Publication number
- JPS6448051U JPS6448051U JP14256887U JP14256887U JPS6448051U JP S6448051 U JPS6448051 U JP S6448051U JP 14256887 U JP14256887 U JP 14256887U JP 14256887 U JP14256887 U JP 14256887U JP S6448051 U JPS6448051 U JP S6448051U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal terminal
- resin
- terminal portion
- porcelain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の半導体装置の縦断面図であり
、ａ図は底面、ｂ図は立面部に金属端子部の主面
が表われている場合の各々に対するものである。
第２図は他の実施例の縦断面図である。 １……金属端子部、２……リードフレーム、３
……シリコンダイ、４……ダイパツト、５……金
線、６……樹脂。
、ａ図は底面、ｂ図は立面部に金属端子部の主面
が表われている場合の各々に対するものである。
第２図は他の実施例の縦断面図である。 １……金属端子部、２……リードフレーム、３
……シリコンダイ、４……ダイパツト、５……金
線、６……樹脂。
Claims (1)
- 外部のプリント基板に接続をするべき金属端子
部が磁器、樹脂等半導体装置のパツケージが形成
する多面体の境界を含む内部に存在し外部に突出
しない事を特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256887U JPS6448051U (ja) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256887U JPS6448051U (ja) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448051U true JPS6448051U (ja) | 1989-03-24 |
Family
ID=31408639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14256887U Pending JPS6448051U (ja) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448051U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621295A (ja) * | 1993-05-24 | 1994-01-28 | Rohm Co Ltd | パッケージ型半導体装置の製造方法 |
| JP2014175443A (ja) * | 2013-03-08 | 2014-09-22 | Murata Mfg Co Ltd | モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 |
-
1987
- 1987-09-18 JP JP14256887U patent/JPS6448051U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621295A (ja) * | 1993-05-24 | 1994-01-28 | Rohm Co Ltd | パッケージ型半導体装置の製造方法 |
| JP2014175443A (ja) * | 2013-03-08 | 2014-09-22 | Murata Mfg Co Ltd | モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 |