JPS6416699U - - Google Patents
Info
- Publication number
- JPS6416699U JPS6416699U JP1987109967U JP10996787U JPS6416699U JP S6416699 U JPS6416699 U JP S6416699U JP 1987109967 U JP1987109967 U JP 1987109967U JP 10996787 U JP10996787 U JP 10996787U JP S6416699 U JPS6416699 U JP S6416699U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- chip
- package
- die pad
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例の断面を示す図、第
２図は同じく、その要部のリードフレームを示す
上面図、第３図は同じくパツケージ段階の要部に
おける断面図、第４図は従来のＩＣパツケージの
断面の一例を示す図、第５図は同じく、従来のＩ
Ｃパツケージにおけるリードフレームの一例を示
す上面図である。 １……ＩＣチツプ、２……ダイパツド、３……
リード、４……ワイヤー、５……パツケージ樹脂
、６……導体、７……接続部。
２図は同じく、その要部のリードフレームを示す
上面図、第３図は同じくパツケージ段階の要部に
おける断面図、第４図は従来のＩＣパツケージの
断面の一例を示す図、第５図は同じく、従来のＩ
Ｃパツケージにおけるリードフレームの一例を示
す上面図である。 １……ＩＣチツプ、２……ダイパツド、３……
リード、４……ワイヤー、５……パツケージ樹脂
、６……導体、７……接続部。
Claims (1)
- ダイパツド上にダイボンドしたＩＣチツプを有
するＩＣパツケージにおいて、上記ＩＣチツプの
上面部分に導体を設け、この導体を上記ダイパツ
ドに電気的に接続した構成を有することを特徴と
するＩＣパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987109967U JPS6416699U (ja) | 1987-07-20 | 1987-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987109967U JPS6416699U (ja) | 1987-07-20 | 1987-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6416699U true JPS6416699U (ja) | 1989-01-27 |
Family
ID=31346695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987109967U Pending JPS6416699U (ja) | 1987-07-20 | 1987-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6416699U (ja) |
-
1987
- 1987-07-20 JP JP1987109967U patent/JPS6416699U/ja active Pending