JPH0467346U - - Google Patents

Info

Publication number
JPH0467346U
JPH0467346U JP11099390U JP11099390U JPH0467346U JP H0467346 U JPH0467346 U JP H0467346U JP 11099390 U JP11099390 U JP 11099390U JP 11099390 U JP11099390 U JP 11099390U JP H0467346 U JPH0467346 U JP H0467346U
Authority
JP
Japan
Prior art keywords
lead
integrated circuit
semiconductor integrated
resin
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11099390U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11099390U priority Critical patent/JPH0467346U/ja
Publication of JPH0467346U publication Critical patent/JPH0467346U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の断面図、第３図は従来の表
面実装型半導体集積回路装置の一例の断面図であ
る。 １ａ，１ｂ……外部引き出しリード、２……樹
脂、３ａ，３ｂ……インナーリード、４……アイ
ランド、５……半導体集積回路素子、６ａ，６ｂ
……ボンデイングワイヤー。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外部引き出しリードの根本の部分について、リ
    ードの側面及び上面を樹脂封止したことを特徴と
    する表面実装型半導体集積回路装置。
JP11099390U 1990-10-23 1990-10-23 Pending JPH0467346U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11099390U JPH0467346U (ja) 1990-10-23 1990-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11099390U JPH0467346U (ja) 1990-10-23 1990-10-23

Publications (1)

Publication Number Publication Date
JPH0467346U true JPH0467346U (ja) 1992-06-15

Family

ID=31858404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11099390U Pending JPH0467346U (ja) 1990-10-23 1990-10-23

Country Status (1)

Country Link
JP (1) JPH0467346U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004179A (ja) * 2010-06-14 2012-01-05 Mitsubishi Electric Corp 半導体装置、半導体装置の実装方法、および実装用治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004179A (ja) * 2010-06-14 2012-01-05 Mitsubishi Electric Corp 半導体装置、半導体装置の実装方法、および実装用治具

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