JPS6370160U - - Google Patents
Info
- Publication number
- JPS6370160U JPS6370160U JP16543086U JP16543086U JPS6370160U JP S6370160 U JPS6370160 U JP S6370160U JP 16543086 U JP16543086 U JP 16543086U JP 16543086 U JP16543086 U JP 16543086U JP S6370160 U JPS6370160 U JP S6370160U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- lead electrode
- molded body
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図Ａはこの考案の樹脂封止型半導体装置の
一実施例の平面図、同図Ｂはその断面図である。
第２図Ａ，Ｂ，Ｃはそれぞれ従来の樹脂封止型半
導体装置の側面図である。 １，１′……内部リード電極、２……樹脂封止
成形体、３……半導体素子、４……接続配線、６
，６′……屈曲部、７，７′……外部リード電極
。
一実施例の平面図、同図Ｂはその断面図である。
第２図Ａ，Ｂ，Ｃはそれぞれ従来の樹脂封止型半
導体装置の側面図である。 １，１′……内部リード電極、２……樹脂封止
成形体、３……半導体素子、４……接続配線、６
，６′……屈曲部、７，７′……外部リード電極
。
Claims (1)
- 樹脂封止成形体内に埋め込まれた内部リード電
極部に屈曲部が設けられていることを特徴とする
樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16543086U JPS6370160U (ja) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16543086U JPS6370160U (ja) | 1986-10-28 | 1986-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6370160U true JPS6370160U (ja) | 1988-05-11 |
Family
ID=31095464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16543086U Pending JPS6370160U (ja) | 1986-10-28 | 1986-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370160U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018057590A (ja) * | 2016-10-05 | 2018-04-12 | 株式会社パジコ | アクセサリおよびその製造方法並びにアクセサリ用のヒートン |
-
1986
- 1986-10-28 JP JP16543086U patent/JPS6370160U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018057590A (ja) * | 2016-10-05 | 2018-04-12 | 株式会社パジコ | アクセサリおよびその製造方法並びにアクセサリ用のヒートン |